IEICE Technical Report

Print edition: ISSN 0913-5685      Online edition: ISSN 2432-6380

Volume 114, Number 381

Electromagnetic Compatibility

Workshop Date : 2014-12-19 / Issue Date : 2014-12-12

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Table of contents

EMCJ2014-74
Fast Transient Simulation of Non-uniform Distributed Parameter Circuit with Nonlinear Device by Locally Implicit LIM
Shingo Okada, Hideki Asai (Shizuoka Univ.)
pp. 1 - 6

EMCJ2014-75
Fast Transient Simulation of the Large Scale Circuit Networks by Using Multi-GPU LIM
Yuta Inoue, Hideki Asai (Shizuoka Univ.)
pp. 7 - 12

EMCJ2014-76
Electromagnetic Interference Evaluation for a Wearable ECG at Frequencies below 1 MHz
Wei Liao, Jingjing Shi, Jianqing Wang (Nagoya Inst. of Tech.)
pp. 13 - 18

EMCJ2014-77
Propagation Characteristics and BER Evaluation on On-Body 30MHz/In-Body 400MHz-Band Dual-Mode Communication
Yohei Yoshida, Daisuke Anzai, Jianqing Wang (NIT)
pp. 19 - 24

EMCJ2014-78
Dielectric properties measurement of biological samples using high speed sampling at frequencies below 1 MHz
Hiroyuki Nedate (Aoyama Gakuin Univ./NICT), Kanako Wake, Kensuke Sasaki, Katsumi Fujii, Soichi Watanabe (NICT), Ryosuke Suga, Osamu Hashimoto (Aoyama Gakuin Univ.)
pp. 25 - 30

EMCJ2014-79
Accuracy Improvement in the Analysis of Core Temperature Elevation in Adult Female and Infant for Far-Field Microwave Exposure
Youhei Asano, Ilkka Laakso, Akimasa Hirata (Nagoya Inst. of Tech.)
pp. 31 - 35

EMCJ2014-80
Analysis of Transmission Characteristics for Twisted Pair Cables using the RLGC Parameters of the Cable
Mitsutaku Yamamura, Yoshio Kami (UEC), Kimitoshi Murano (Tokai Univ.), Fengchao Xiao (UEC)
pp. 63 - 68

EMCJ2014-81
Flexibility of On-Board RL Snubber for PDN Resonance Damping in terms of Mount Location
Kengo Iokibe, Yoshitaka Toyota (Okayama Univ.)
pp. 69 - 74

EMCJ2014-82
Security Evaluation of CSSAL Countermeasure against Side-Channel Attacks Using Frequency Spectrum Analysis
Cancio Monteiro, Yasuhiro Takahashi, Toshikazu Sekine (Gifu Univ.)
pp. 75 - 80

EMCJ2014-83
[Special Talk] SI/PI/EMI Simulation Techniques and Their Exploitation for Chip/Package/Board/Chassis Co-design -- Multi-domain Simulation --
Hideki Asai (Shizuoka Univ.)
p. 81

Note: Each article is a technical report without peer review, and its polished version will be published elsewhere.


The Institute of Electronics, Information and Communication Engineers (IEICE), Japan