|
|
All Technical Committee Conferences (Searched in: All Years)
|
|
Search Results: Conference Papers |
Conference Papers (Available on Advance Programs) (Sort by: Date Descending) |
|
Committee |
Date Time |
Place |
Paper Title / Authors |
Abstract |
Paper # |
SDM |
2019-02-07 11:25 |
Tokyo |
|
[Invited Talk]
Ultrafine 3D Interconnect Technology Using Directed Self-Assembly Takafumi Fukushima, Murugesan Mariappan, Mitsumasa Koyanagi (Tohoku Univ.) SDM2018-92 |
A directed self-assembly (DSA) technology is applied to fabricate ultrafine pitch TSV (Through-Silicon Vias) for ultra-h... [more] |
SDM2018-92 pp.5-8 |
EMCJ, IEE-EMC, IEE-MAG |
2018-11-22 14:20 |
Overseas |
KAIST |
A Novel Eye-Diagram Estimation Method for Pulse Amplitude Modulation with N-level on Stacked Through Silicon Vias Junyong Park, Youngwoo Kim, Kyungjun Cho, Seongsoo Lee, Joungho Kim (KAIST) EMCJ2018-64 |
This paper proposed an eye-diagram estimation method for pulse amplitude modulation with N-level signaling. For verifica... [more] |
EMCJ2018-64 p.29 |
EMCJ, IEE-EMC, IEE-MAG |
2016-06-02 16:10 |
Overseas |
NTU, Taiwan |
[Invited Talk]
Modeling and Measuring Vertical Interconnects with Impedance Control Over a Wide Frequency Range Kuan-Chung Lu, Tzyy-Sheng Horng (National Sun Yat-sen Univ.) EMCJ2016-35 |
The advantages of vertical interconnects include superior electrical transmissions for stacked dies, higher I/O density,... [more] |
EMCJ2016-35 pp.57-62 |
VLD, DC, IPSJ-SLDM, CPSY, RECONF, ICD, CPM (Joint) [detail] |
2014-11-26 14:45 |
Oita |
B-ConPlaza |
Investigation of the area reduction of observation part and control part in TSV fault detection circuit Youhei Miyamoto, Hiroyuki Yotsuyanagi, Masaki Hashizume (Tokushima Univ.) VLD2014-72 DC2014-26 |
Since delay caused by an open TSV is usually very small, it is defficult to detect. Therefore, we have proposed a TSV fa... [more] |
VLD2014-72 DC2014-26 pp.3-8 |
SDM |
2014-02-28 15:20 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
[Invited Talk]
TSV Liner Formation with Vapor Deposited Polyimides Takafumi Fukushima, Mariappan Murugesan, Jicheol Bea, Kangwook Lee, Mitsumasa Koyanagi (Tohoku Univ.) SDM2013-172 |
A Kapton insulation layer as a TSV liner was conformably formed by vapor deposition polymerization with pyromellitic dia... [more] |
SDM2013-172 pp.39-42 |
CPM |
2010-07-30 09:30 |
Hokkaido |
Michino-Eki Shari Meeting Room |
Low temperature of deposition of ZrNx film using radical reaction Masaru Sato, Mayumi B. Takeyama (kitami Inst. of Tech.), Yuichiro Hayasaka, Eiji Aoyagi (Tohoku Univ.), Atsushi Noya (kitami Inst. of Tech.) CPM2010-36 |
Recently, an increase in the integration density of the Si-ULSI system is realized in the 3-D packaging
technology. A t... [more] |
CPM2010-36 pp.29-34 |
SDM |
2008-03-14 15:25 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
Through-silicon Via Interconnection for 3D Integration Using Room-temperature Bonding Naotaka Tanaka, Yasuhiro Yoshimura, Michihiro Kawashita (Hitachi), Toshihide Uematsu, Takahiro Naitoh, Takashi Akazawa (Renesas) SDM2007-277 |
One approach to 3D technology is chip stacking using through-silicon vias (TSVs). Interconnects in a 3D assembly are pot... [more] |
SDM2007-277 pp.21-26 |
|
|
|
Copyright and reproduction :
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
|
[Return to Top Page]
[Return to IEICE Web Page]
|