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All Technical Committee Conferences (Searched in: All Years)
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Search Results: Conference Papers |
Conference Papers (Available on Advance Programs) (Sort by: Date Descending) |
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Committee |
Date Time |
Place |
Paper Title / Authors |
Abstract |
Paper # |
CPM |
2019-02-28 16:20 |
Tokyo |
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Electrical characterization of metal-insulator-metal stacked structure using ZrNx thin film Hideki Kitada, Masaru Sato, Mayumi Takeyama (Kitami Institute) CPM2018-111 |
The rectification function to prevent a multivalued function and the snaking current in two-terminal operation is necess... [more] |
CPM2018-111 pp.45-48 |
CPM |
2018-08-10 10:10 |
Aomori |
Hirosaki Univ. |
Characterization of ZrOxNy thin films deposited at low temperatures Masaru Sato, Hideki Kitada, Mayumi B. Takeyama (kitami inst. of tech.) CPM2018-16 |
[more] |
CPM2018-16 pp.39-42 |
PRMU, MVE, IPSJ-CVIM (Joint) [detail] |
2013-01-23 10:00 |
Kyoto |
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Character String Extraction from Scene Images Using Direction Distribution of Edge Components and their Spatial Arrangements Hideki Kitada, Toru Wakahara (Hosei Univ.) PRMU2012-85 MVE2012-50 |
This paper proposes a method for character string extraction from scene images using direction distribution of edge comp... [more] |
PRMU2012-85 MVE2012-50 pp.29-34 |
SDM |
2012-03-05 15:25 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
Influence of Via Stress on Surface Micro-roughness-induced Leakage Current in Through-Silicon Via Interconnects Hideki Kitada (Univ. of Tokyo/Fujitsu Lab.), Nobuhide Maeda, Koji Fujimoto, Shoichi Kodama, Young Suk Kim (Univ. of Tokyo), Yoriko Mizushima (Univ. of Tokyo/Fujitsu Lab.), Tomoji Nakamura (Fujitsu Lab.), Takayuki Ohba (Univ. of Tokyo) SDM2011-183 |
[more] |
SDM2011-183 pp.41-46 |
SDM |
2012-03-05 15:55 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
Characterization of Local Strain around Through Silicon Via Interconnect in Wafer-on-wafer Structures Osamu Nakatsuka (Nagoya Univ.), Hideki Kitada, Young Suk Kim (Univ. of Tokyo), Yoriko Mizushima, Tomoji Nakamura (Fujitsu Lab.), Takayuki Ohba (Univ. of Tokyo), Shigeaki Zaima (Nagoya Univ.) SDM2011-184 |
We have investigated the local strain structure in a thinned Si layer stacked on Si substrate for wafer-on-a-wafer appli... [more] |
SDM2011-184 pp.47-52 |
SDM |
2011-02-07 15:25 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
Development of Low Temperature Bump-less TSV Process in 3D Stacking Technology Hideki Kitada, Nobuhide Maeda (The Univ. of Tokyo), Koji Fujimoto (Dai Nippon Printing), Yoriko Mizushima, Yoshihiro Nakata, Tomoji Nakamura (Fujitsu Laboratories Ltd.), Takayuki Ohba (The Univ. of Tokyo) SDM2010-224 |
Diffusion behavior of Cu in Cu through-silicon-vias (TSVs) fabricated using low-temperature plasma enhanced chemical vap... [more] |
SDM2010-224 pp.49-53 |
ICD, SDM |
2010-08-27 10:15 |
Hokkaido |
Sapporo Center for Gender Equality |
[Invited Talk]
Development of sub-10um Thinning Technology using Actual Device Wafers Nobuhide Maeda, Kim Youngsuk (Univ. of Tokyo), Yukinobu Hikosaka, Takashi Eshita (FSL), Hideki Kitada, Koji Fujimoto (Univ. of Tokyo), Yoriko Mizushima (Fujitsu Labs.), Kousuke Suzuki (DNP), Tomoji Nakamura (Fujitsu Labs.), Akihito Kawai, Kazuhisa Arai (DISCO), Takayuki Ohba (Univ. of Tokyo) SDM2010-141 ICD2010-56 |
200-mm and 300-mm device wafers were successfully thinned down to less than 10-μm. A 200-nm non-crystalline layer remain... [more] |
SDM2010-141 ICD2010-56 pp.95-97 |
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