IEICE Technical Report

Online edition: ISSN 2432-6380

Volume 123, Number 142

Component Parts and Materials

Workshop Date : 2023-07-31 - 2023-08-01 / Issue Date : 2023-07-24

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Table of contents

CPM2023-10
Measurement of plant information using bioelectrical impedance analysis
Daichi Nakashima, Masaru Sato, Mayumi B. Takeyama (Kitami Inst. of Tech.)
pp. 1 - 2

CPM2023-11
Effect of Electrical Irradiation on the Early Growth of Nicotiana Benthamiana
Hikaru Murakami, Masaru Sato (Kitami Inst. Tech.), Koji Kashima (ASAHI KOGYOSHA), Mayumi B. Takeyama (Kitami Inst. Tech./WOW Alliance)
pp. 3 - 4

CPM2023-12
Effect of Inorganic Filler on the Characteristic of Dental Acrylic Resin
Ryo Morita (Kitami Inst. of Tech.), Kunihiro Takei, Yuki Uchida (FUJIMORI KOGYO CO., LTD./WOW Alliance), Katsumi Hiranuma (WOW Alliance), Masaru Sato (Kitami Inst. of Tech.), Mayumi B. Takeyama (Kitami Inst. of Tech./WOW Alliance)
pp. 5 - 6

CPM2023-13
Evaluation of VUV Absorption Characteristics in Surface Modification of Dielectric Resin Materials by VUV Light
Shinichi Endo, Yuki Ishikawa (Osaka Prefecture University), Hina Shirakashi, Takeyasu Saito (Osaka Metropolitan univ.)
pp. 7 - 10

CPM2023-14
Investigation of MIM structure with ZrN electrode as Resistive Random Access Memory
Toyoki Miura, Masaru Sato, Mayumi Takeyama (Kitami Institute)
pp. 11 - 12

CPM2023-15
Development of multi-layer film recording media with thermal diffusion layer for magnetic hologram recording
Hirotomo Sugiura (TUT), Shinichiro Mito (TNCT), Yuichi Nakamura, Lim Pang Boey (TUT)
pp. 13 - 16

CPM2023-16
[Invited Talk] Improvement of adhesion and plating of fluoropolymers by plasma surface modification
Yasuyuki Kobayashi, Shingo Ikeda (ORIST)
pp. 17 - 20

CPM2023-17
[Invited Talk] Progress and future perspective of room-temperature bonding technologies for heterogeneous integration
Eiji Higurashi, Kai Takeuchi (Tohoku Univ.)
pp. 21 - 24

CPM2023-18
The effect of surface modified epoxy-type resin by UV irradiation
Takeyasu Saito, Hina Shirakashi, Takumi Nishiura (Osaka Metropolitan Univ.), Shinichi Endo (Osaka Metropolitan Univ./Ushio Inc.), Yuki Ishikawa (Osaka Metropolitan Univ./SANYU REC.LTD.), Naoki Okamoto (Osaka Metropolitan Univ.)
pp. 25 - 28

CPM2023-19
Fabrication of SiC/AlN multilayer structure on 3°off-axis Si(110) substrate and graphene formation thereon
Ryosuke Saito, Yuki Nara, Daiki Kasai, Haruto Koriyama, Yoshiharu Enta, Hideki Nakazawa (Hirosaki Univ.)
pp. 29 - 32

CPM2023-20
Evaluation of the Physical Properties of Reactive sputtered Ti or V-based MAX alloy thin film
Kazuki Ueda, Kazunobu Wkamatsu, Takeyasu Saito, Naoki Okamoto (Osaka Metropolitan Univ.)
pp. 33 - 35

CPM2023-21
Review of Characterization of Metal/GaN Schottky Contacts
Kenji Shiojima (Univ. of Fukui)
pp. 36 - 39

CPM2023-22
[Invited Talk] The era of Japan, the Silicon Island, has come -- rushing of building new factories for semiconductor-related companies from Japan and overseas --
Wataru Izumiya (Sangyo Times, Inc.)
pp. 40 - 43

Note: Each article is a technical report without peer review, and its polished version will be published elsewhere.


The Institute of Electronics, Information and Communication Engineers (IEICE), Japan