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Technical Committee on Component Parts and Materials (CPM)  (Searched in: 2007)

Search Results: Keywords 'from:2008-01-17 to:2008-01-17'

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Search Results: Conference Papers
 Conference Papers (Available on Advance Programs)  (Sort by: Date Ascending)
 Results 1 - 20 of 21  /  [Next]  
Committee Date Time Place Paper Title / Authors Abstract Paper #
CPM, ICD 2008-01-17
09:15
Tokyo Kikai-Shinko-Kaikan Bldg Non-Contact 10% Efficient 36mW Power Delivery Using On-Chip Inductor in 0.18-um CMOS
Yuan Yuxiang, Yoichi Yoshida, Tadahiro Kuroda (keio Univ.) CPM2007-128 ICD2007-139
 [more] CPM2007-128 ICD2007-139
pp.1-4
CPM, ICD 2008-01-17
09:40
Tokyo Kikai-Shinko-Kaikan Bldg Integrated evaluation of on-chip power supply noise and off-chip electromagnetic noise on digital LSI
Yuki Takahashi (Kobe Univ.), Kouji Ichikawa (Denso), Makoto Nagata (Kobe Univ.) CPM2007-129 ICD2007-140
 [more] CPM2007-129 ICD2007-140
pp.5-10
CPM, ICD 2008-01-17
10:05
Tokyo Kikai-Shinko-Kaikan Bldg ptimization of Active Substrate Noise Cancellng Technique Using Multi di/dt Detectors
Toru Nakura, Taisuke Kazama, Makoto Ikeda, Kunihiro Asada (The Univ. of Tokyo) CPM2007-130 ICD2007-141
This paper demonstrates study on a feedforward active substrate noise cancelling technique using a power supply di/dt de... [more] CPM2007-130 ICD2007-141
pp.11-16
CPM, ICD 2008-01-17
10:45
Tokyo Kikai-Shinko-Kaikan Bldg All Digital Gated Oscillator for Dynamic Supply Noise Measurement
Yasuhiro Ogasahara, Masanori Hashimoto, Takao Onoye (Osaka Univ.) CPM2007-131 ICD2007-142
This paper proposes an all digital measurement circuit called ``gated oscillator'' for capturing waveforms of dynamic po... [more] CPM2007-131 ICD2007-142
pp.17-22
CPM, ICD 2008-01-17
11:10
Tokyo Kikai-Shinko-Kaikan Bldg Design of an On-Chip Noise Canceller with High Voltage Supply Lines for Nanosecond-Range Power Supply Noise
Yasumi Nakamura, Makoto Takamiya, Takayasu Sakurai (Univ. of Tokyo) CPM2007-132 ICD2007-143
An on-chip noise canceller with high voltage supply lines for the nanosecond-range power supply noise is proposed. The ... [more] CPM2007-132 ICD2007-143
pp.23-27
CPM, ICD 2008-01-17
11:35
Tokyo Kikai-Shinko-Kaikan Bldg LSI and PCB Unified Noise Analysis CAD System
Toshiro Sato, Hiroyuki Orihara, Shogo Fujimori, Masaki Tosaka (FATEC) CPM2007-133 ICD2007-144
 [more] CPM2007-133 ICD2007-144
pp.29-34
CPM, ICD 2008-01-17
13:00
Tokyo Kikai-Shinko-Kaikan Bldg [Special Invited Talk] On-chip monitors and power-supply integrity
Makoto Nagata (Kobe Univ.) CPM2007-134 ICD2007-145
 [more] CPM2007-134 ICD2007-145
pp.35-40
CPM, ICD 2008-01-17
13:40
Tokyo Kikai-Shinko-Kaikan Bldg [Special Invited Talk] Techniques for power supply noise management in the SX supercomputers
Jun Inasaka, Mikihiro Kajita (NEC Corp.) CPM2007-135 ICD2007-146
NEC has developed supercomputers "SX" using the leading-edge LSI technologies. In the latest microprocessors, CMOS trans... [more] CPM2007-135 ICD2007-146
pp.41-46
CPM, ICD 2008-01-17
14:30
Tokyo Kikai-Shinko-Kaikan Bldg [Special Invited Talk] In-situ measurement of supply-noise maps with millivolt accuracy and nanosecond-order time resolution
Yusuke Kanno, Yuki Kondoh (HCRL), Takahiro Irita, Kenji Hirose, Ryo Mori, Yoshihiko Yasu (Renesas Technology, Corp.), Shigenobu Komatsu, Hiroyuki Mizuno (HCRL) CPM2007-136 ICD2007-147
An in-situ measurement scheme for generating supply-noise maps, which can be conducted while running applications in pro... [more] CPM2007-136 ICD2007-147
pp.47-52
CPM, ICD 2008-01-18
09:40
Tokyo Kikai-Shinko-Kaikan Bldg Arithmetic operation circuit based on abacus architecture
Syunsuke Nagasawa, Shugang Wei (Gunma Univ) CPM2007-137 ICD2007-148
In arithmetic circuits, the carrying propagation limits the
operation speed. To shorten the length of the carrying pr... [more]
CPM2007-137 ICD2007-148
pp.53-58
CPM, ICD 2008-01-18
10:05
Tokyo Kikai-Shinko-Kaikan Bldg A compact RF signal quality measurement macro for RF test and diagnosis
Koichi Nose, Masayuki Mizuno (NEC) CPM2007-138 ICD2007-149
Our RF signal-quality measurement macro employs 1) a new window-shifting measurement technique that obtains the power of... [more] CPM2007-138 ICD2007-149
pp.59-64
CPM, ICD 2008-01-18
10:30
Tokyo Kikai-Shinko-Kaikan Bldg A Method for Measuring Vref Noise Tolerance of DDR2-SDRAM on Test Board that Simulates Memory Module
Yutaka Uematsu, Hideki Osaka (Hitachi), Yoji Nishio, Susumu Hatano (Elpida) CPM2007-139 ICD2007-150
Aiming to achieve double data rate-synchronous DRAM (DDR-SDRAM) at low-cost and with high noise tolerance by setting ade... [more] CPM2007-139 ICD2007-150
pp.65-69
CPM, ICD 2008-01-18
11:10
Tokyo Kikai-Shinko-Kaikan Bldg [Tutorial Lecture] Survey of Analysis Techniques for On-chip Power Distribution Networks
Takashi Sato (Tokyo Tech.) CPM2007-140 ICD2007-151
Primary techniques and recent trends in power distribution network
(PDN) analysis are reviewed in this paper. Quality ... [more]
CPM2007-140 ICD2007-151
pp.71-76
CPM, ICD 2008-01-18
13:00
Tokyo Kikai-Shinko-Kaikan Bldg Study on Low Stress Condition of Pseudo-SOC Integration Using Stress Analysis
Yutaka Onozuka, Hiroshi Yamada, Atsuko Iida, Kazuhiko Itaya, Hideyuki Funaki (Toshiba R & D Center) CPM2007-141 ICD2007-152
The authors have proposed a pseudo-SOC (System on Chip) technology, forming redistribution global layer with semiconduct... [more] CPM2007-141 ICD2007-152
pp.77-82
CPM, ICD 2008-01-18
13:25
Tokyo Kikai-Shinko-Kaikan Bldg An Extraction Method of Material Constants by Transmission Line Measurements
Hiroshi Toyao, Yoshiaki Wakabayashi (NEC) CPM2007-142 ICD2007-153
The material constants of dielectric materials such as solder resist have a large influence on the accuracy of the elect... [more] CPM2007-142 ICD2007-153
pp.83-86
CPM, ICD 2008-01-18
13:50
Tokyo Kikai-Shinko-Kaikan Bldg A Package-on-Package using Coreless Substrate with Excellent Power Integrity
Kentaro Mori, Jun Sakai, Katsumi Kikuchi, Shinji Watanabe, Tomoo Murakami, Shintaro Yamamichi (NEC) CPM2007-143 ICD2007-154
(To be available after the conference date) [more] CPM2007-143 ICD2007-154
pp.87-92
CPM, ICD 2008-01-18
14:15
Tokyo Kikai-Shinko-Kaikan Bldg Assessment Test for Solder Joint Reliability in Mobile Products
Masazumi Amagai, Hiroyuki Sano (TI Japan) CPM2007-144 ICD2007-155
When a mobile phone is dropped, the frequency of occurrence of cracks in solder joints is high. Voids in intermetallic ... [more] CPM2007-144 ICD2007-155
pp.93-98
CPM, ICD 2008-01-18
14:55
Tokyo Kikai-Shinko-Kaikan Bldg Chip Thinning Technologies Realizing High Chip Strength
Shinya Takyu, Tetsuya Kurosawa, Noriko Shimizu, Susumu Harada (Toshiba Co.) CPM2007-145 ICD2007-156
Accompanying the rapid progress of the digital network information society, there is strong demand for high functionalit... [more] CPM2007-145 ICD2007-156
pp.99-103
CPM, ICD 2008-01-18
15:20
Tokyo Kikai-Shinko-Kaikan Bldg A multi-layer wafer-level 5-um-thick Cu wiring technology with photosensitive resin
Katsumi Kikuchi (NEC), Kouji Soejima (NECEL), Yasuhiro Ishii (NEC), Masaya Kawano (NECEL), Masayuki Mizuno, Shintaro Yamamichi (NEC) CPM2007-146 ICD2007-157
We have successfully developed a multi-layer wafer-level 5-um-thick Cu wiring technology and an embedded on-chip capacit... [more] CPM2007-146 ICD2007-157
pp.105-110
CPM, ICD 2008-01-18
15:45
Tokyo Kikai-Shinko-Kaikan Bldg A method of Ultra-fine Pad Interconnection using Electroless Deposition
Tokihiko Yokoshima, Yasuhiro Yamaji, Yuichiro Tamura, Katsuya Kikuchi, Hiroshi Nakagawa, Masahiro Aoyagi (AIST) CPM2007-147 ICD2007-158
Decrease in bonding temperature and bonding pressure are key challenges for higher interconnection-density packages in r... [more] CPM2007-147 ICD2007-158
pp.111-116
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