Committee |
Date Time |
Place |
Paper Title / Authors |
Abstract |
Paper # |
CPM, ICD |
2008-01-17 09:15 |
Tokyo |
Kikai-Shinko-Kaikan Bldg |
Non-Contact 10% Efficient 36mW Power Delivery Using On-Chip Inductor in 0.18-um CMOS Yuan Yuxiang, Yoichi Yoshida, Tadahiro Kuroda (keio Univ.) CPM2007-128 ICD2007-139 |
[more] |
CPM2007-128 ICD2007-139 pp.1-4 |
CPM, ICD |
2008-01-17 09:40 |
Tokyo |
Kikai-Shinko-Kaikan Bldg |
Integrated evaluation of on-chip power supply noise and off-chip electromagnetic noise on digital LSI Yuki Takahashi (Kobe Univ.), Kouji Ichikawa (Denso), Makoto Nagata (Kobe Univ.) CPM2007-129 ICD2007-140 |
[more] |
CPM2007-129 ICD2007-140 pp.5-10 |
CPM, ICD |
2008-01-17 10:05 |
Tokyo |
Kikai-Shinko-Kaikan Bldg |
ptimization of Active Substrate Noise Cancellng Technique Using Multi di/dt Detectors Toru Nakura, Taisuke Kazama, Makoto Ikeda, Kunihiro Asada (The Univ. of Tokyo) CPM2007-130 ICD2007-141 |
This paper demonstrates study on a feedforward active substrate noise cancelling technique using a power supply di/dt de... [more] |
CPM2007-130 ICD2007-141 pp.11-16 |
CPM, ICD |
2008-01-17 10:45 |
Tokyo |
Kikai-Shinko-Kaikan Bldg |
All Digital Gated Oscillator for Dynamic Supply Noise Measurement Yasuhiro Ogasahara, Masanori Hashimoto, Takao Onoye (Osaka Univ.) CPM2007-131 ICD2007-142 |
This paper proposes an all digital measurement circuit called ``gated oscillator'' for capturing waveforms of dynamic po... [more] |
CPM2007-131 ICD2007-142 pp.17-22 |
CPM, ICD |
2008-01-17 11:10 |
Tokyo |
Kikai-Shinko-Kaikan Bldg |
Design of an On-Chip Noise Canceller with High Voltage Supply Lines for Nanosecond-Range Power Supply Noise Yasumi Nakamura, Makoto Takamiya, Takayasu Sakurai (Univ. of Tokyo) CPM2007-132 ICD2007-143 |
An on-chip noise canceller with high voltage supply lines for the nanosecond-range power supply noise is proposed. The ... [more] |
CPM2007-132 ICD2007-143 pp.23-27 |
CPM, ICD |
2008-01-17 11:35 |
Tokyo |
Kikai-Shinko-Kaikan Bldg |
LSI and PCB Unified Noise Analysis CAD System Toshiro Sato, Hiroyuki Orihara, Shogo Fujimori, Masaki Tosaka (FATEC) CPM2007-133 ICD2007-144 |
[more] |
CPM2007-133 ICD2007-144 pp.29-34 |
CPM, ICD |
2008-01-17 13:00 |
Tokyo |
Kikai-Shinko-Kaikan Bldg |
[Special Invited Talk]
On-chip monitors and power-supply integrity Makoto Nagata (Kobe Univ.) CPM2007-134 ICD2007-145 |
[more] |
CPM2007-134 ICD2007-145 pp.35-40 |
CPM, ICD |
2008-01-17 13:40 |
Tokyo |
Kikai-Shinko-Kaikan Bldg |
[Special Invited Talk]
Techniques for power supply noise management in the SX supercomputers Jun Inasaka, Mikihiro Kajita (NEC Corp.) CPM2007-135 ICD2007-146 |
NEC has developed supercomputers "SX" using the leading-edge LSI technologies. In the latest microprocessors, CMOS trans... [more] |
CPM2007-135 ICD2007-146 pp.41-46 |
CPM, ICD |
2008-01-17 14:30 |
Tokyo |
Kikai-Shinko-Kaikan Bldg |
[Special Invited Talk]
In-situ measurement of supply-noise maps with millivolt accuracy and nanosecond-order time resolution Yusuke Kanno, Yuki Kondoh (HCRL), Takahiro Irita, Kenji Hirose, Ryo Mori, Yoshihiko Yasu (Renesas Technology, Corp.), Shigenobu Komatsu, Hiroyuki Mizuno (HCRL) CPM2007-136 ICD2007-147 |
An in-situ measurement scheme for generating supply-noise maps, which can be conducted while running applications in pro... [more] |
CPM2007-136 ICD2007-147 pp.47-52 |
CPM, ICD |
2008-01-18 09:40 |
Tokyo |
Kikai-Shinko-Kaikan Bldg |
Arithmetic operation circuit based on abacus architecture Syunsuke Nagasawa, Shugang Wei (Gunma Univ) CPM2007-137 ICD2007-148 |
In arithmetic circuits, the carrying propagation limits the
operation speed. To shorten the length of the carrying pr... [more] |
CPM2007-137 ICD2007-148 pp.53-58 |
CPM, ICD |
2008-01-18 10:05 |
Tokyo |
Kikai-Shinko-Kaikan Bldg |
A compact RF signal quality measurement macro for RF test and diagnosis Koichi Nose, Masayuki Mizuno (NEC) CPM2007-138 ICD2007-149 |
Our RF signal-quality measurement macro employs 1) a new window-shifting measurement technique that obtains the power of... [more] |
CPM2007-138 ICD2007-149 pp.59-64 |
CPM, ICD |
2008-01-18 10:30 |
Tokyo |
Kikai-Shinko-Kaikan Bldg |
A Method for Measuring Vref Noise Tolerance of DDR2-SDRAM on Test Board that Simulates Memory Module Yutaka Uematsu, Hideki Osaka (Hitachi), Yoji Nishio, Susumu Hatano (Elpida) CPM2007-139 ICD2007-150 |
Aiming to achieve double data rate-synchronous DRAM (DDR-SDRAM) at low-cost and with high noise tolerance by setting ade... [more] |
CPM2007-139 ICD2007-150 pp.65-69 |
CPM, ICD |
2008-01-18 11:10 |
Tokyo |
Kikai-Shinko-Kaikan Bldg |
[Tutorial Lecture]
Survey of Analysis Techniques for On-chip Power Distribution Networks Takashi Sato (Tokyo Tech.) CPM2007-140 ICD2007-151 |
Primary techniques and recent trends in power distribution network
(PDN) analysis are reviewed in this paper. Quality ... [more] |
CPM2007-140 ICD2007-151 pp.71-76 |
CPM, ICD |
2008-01-18 13:00 |
Tokyo |
Kikai-Shinko-Kaikan Bldg |
Study on Low Stress Condition of Pseudo-SOC Integration Using Stress Analysis Yutaka Onozuka, Hiroshi Yamada, Atsuko Iida, Kazuhiko Itaya, Hideyuki Funaki (Toshiba R & D Center) CPM2007-141 ICD2007-152 |
The authors have proposed a pseudo-SOC (System on Chip) technology, forming redistribution global layer with semiconduct... [more] |
CPM2007-141 ICD2007-152 pp.77-82 |
CPM, ICD |
2008-01-18 13:25 |
Tokyo |
Kikai-Shinko-Kaikan Bldg |
An Extraction Method of Material Constants by Transmission Line Measurements Hiroshi Toyao, Yoshiaki Wakabayashi (NEC) CPM2007-142 ICD2007-153 |
The material constants of dielectric materials such as solder resist have a large influence on the accuracy of the elect... [more] |
CPM2007-142 ICD2007-153 pp.83-86 |
CPM, ICD |
2008-01-18 13:50 |
Tokyo |
Kikai-Shinko-Kaikan Bldg |
A Package-on-Package using Coreless Substrate with Excellent Power Integrity Kentaro Mori, Jun Sakai, Katsumi Kikuchi, Shinji Watanabe, Tomoo Murakami, Shintaro Yamamichi (NEC) CPM2007-143 ICD2007-154 |
(To be available after the conference date) [more] |
CPM2007-143 ICD2007-154 pp.87-92 |
CPM, ICD |
2008-01-18 14:15 |
Tokyo |
Kikai-Shinko-Kaikan Bldg |
Assessment Test for Solder Joint Reliability in Mobile Products Masazumi Amagai, Hiroyuki Sano (TI Japan) CPM2007-144 ICD2007-155 |
When a mobile phone is dropped, the frequency of occurrence of cracks in solder joints is high. Voids in intermetallic ... [more] |
CPM2007-144 ICD2007-155 pp.93-98 |
CPM, ICD |
2008-01-18 14:55 |
Tokyo |
Kikai-Shinko-Kaikan Bldg |
Chip Thinning Technologies Realizing High Chip Strength Shinya Takyu, Tetsuya Kurosawa, Noriko Shimizu, Susumu Harada (Toshiba Co.) CPM2007-145 ICD2007-156 |
Accompanying the rapid progress of the digital network information society, there is strong demand for high functionalit... [more] |
CPM2007-145 ICD2007-156 pp.99-103 |
CPM, ICD |
2008-01-18 15:20 |
Tokyo |
Kikai-Shinko-Kaikan Bldg |
A multi-layer wafer-level 5-um-thick Cu wiring technology with photosensitive resin Katsumi Kikuchi (NEC), Kouji Soejima (NECEL), Yasuhiro Ishii (NEC), Masaya Kawano (NECEL), Masayuki Mizuno, Shintaro Yamamichi (NEC) CPM2007-146 ICD2007-157 |
We have successfully developed a multi-layer wafer-level 5-um-thick Cu wiring technology and an embedded on-chip capacit... [more] |
CPM2007-146 ICD2007-157 pp.105-110 |
CPM, ICD |
2008-01-18 15:45 |
Tokyo |
Kikai-Shinko-Kaikan Bldg |
A method of Ultra-fine Pad Interconnection using Electroless Deposition Tokihiko Yokoshima, Yasuhiro Yamaji, Yuichiro Tamura, Katsuya Kikuchi, Hiroshi Nakagawa, Masahiro Aoyagi (AIST) CPM2007-147 ICD2007-158 |
Decrease in bonding temperature and bonding pressure are key challenges for higher interconnection-density packages in r... [more] |
CPM2007-147 ICD2007-158 pp.111-116 |