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 Conference Papers (Available on Advance Programs)  (Sort by: Date Descending)
 Results 1 - 13 of 13  /   
Committee Date Time Place Paper Title / Authors Abstract Paper #
EE, IEE-SPC 2023-07-20
13:00
Hyogo
(Primary: On-site, Secondary: Online)
[Invited Talk] Latest Trends in Automotive Power Electronics and Application of Magnetic Components
Jun Imaoka (NU) EE2023-9
Recently, achieving carbon neutrality which means balancing CO2 emissions and absorption is a global concern. Especially... [more] EE2023-9
pp.1-50
MW 2023-05-18
14:45
Kyoto Ritsumeikan University
(Primary: On-site, Secondary: Online)
A Basic Study of a Heat dissipation 8-way Waveguide Power Combiner
Akimichi Hirota, Takeshi Oshima, Jun Nishihara, Hiroyuki Nonomura, Toru Fukasawa, Yoshio Inasawa (Mitsubishi Electric Corp.) MW2023-9
A coaxial to waveguide transition is used when signals are transmitted with low loss. When a large power is input to the... [more] MW2023-9
pp.1-5
CCS 2023-03-27
09:00
Hokkaido RUSUTSU RESORT Medical Image Segmentation with Inverse Heat Dissipation Model
Yu Kashihara, Takashi Matsubara (Osaka Univ.) CCS2022-82
The diffusion model is a generative model based on stochastic transitions and has been successfully used to generate
an... [more]
CCS2022-82
pp.107-112
MW 2022-05-20
10:00
Kyoto Kyoto Univ.
(Primary: On-site, Secondary: Online)
A Basic Study of a Heat dissipation Coaxial to Waveguide Transition
Akimichi Hirota, Takeshi Oshima, Jun Nishihara, Hiroyuki Nonomura, Toru Fukasawa, Yoshio Inasawa (Mitsubishi Electric) MW2022-16
A coaxial to waveguide transition is used when signals are transmitted with low loss. When a large power is input to the... [more] MW2022-16
pp.8-12
MW 2022-03-03
09:35
Online Online Chip Resistors for Heat Dissipation on RF circuits
Yuta Sugiyama, Hidenori Ishibashi, Takeshi Oshima, Hidenori Yukawa, Toru Fukasawa, Toru Takahashi, Yoshio Inasawa (Mitsubishi Electric) MW2021-112
In this paper we present that the technology of heat dissipation for RF circuit using chip resistors. The quarter wavele... [more] MW2021-112
pp.7-11
WPT 2020-12-08
14:20
Online Online Development of Power Transmitter for the 24GHz-Band WiCoPT System and the Power Transmission Experiment
Kota Kinugawa, Toshio Ishizaki, Takayuki Matsumuro (Ryukoku Univ.) WPT2020-29
A 24GHz band WiCoPT (Wireless Communication and Power Transmission) demo system has been developed for battery-less sens... [more] WPT2020-29
pp.17-20
MSS, CAS, SIP, VLD 2020-06-18
14:25
Online Online Thermal transient analysis of the heat generation and design of temperature control circuit in three-dimensional stacked chip
Tomoaki Oikawa, Kimiyoshi Usami (Shibaura Inst. of Tech.) CAS2020-9 VLD2020-9 SIP2020-25 MSS2020-9
As a technology for improving the degree of integration of LSI, there is a three-dimensional stacking technology of LSI ... [more] CAS2020-9 VLD2020-9 SIP2020-25 MSS2020-9
pp.47-52
HWS, VLD 2019-02-28
10:00
Okinawa Okinawa Ken Seinen Kaikan Thermal transient analysis and evaluation of the heat generation and dissipation in three-dimensional stacked LSI
Ryota Horigome, Kimiyoshi Usami (Shibaura Inst. of Tech.) VLD2018-107 HWS2018-70
As a technology for improving the degree of integration of LSI, there is a three-dimensional stacking technology of LSI ... [more] VLD2018-107 HWS2018-70
pp.85-90
SDM, ICD, ITE-IST [detail] 2017-08-02
10:50
Hokkaido Hokkaido-Univ. Multimedia Education Bldg. [Invited Talk] Capacitor-less neuron circuits using metal-insulator transition devices
Takeaki Yajima, Tomonori Nishimura, Akira Toriumi (Univ. of Tokyo) SDM2017-44 ICD2017-32
The metal-insulator transition of VO2 is exploited in neuromorphic circuits, resulting in a capacitor-less neuron circui... [more] SDM2017-44 ICD2017-32
pp.107-108
SANE 2013-06-21
14:55
Ibaraki Tsukuba Space Center, JAXA Development and Results of On-orbit Experiment of Flat-plate Heat Pipe onboard SDS-4
Makiko Ando, Atsushi Okamoto, Masakatsu Maeda, Hiroyuki Sugita (JAXA) SANE2013-30
An Oscillating heat pipe (OHP), which is a thin heat transfer device with high heat transfer capability, is expected to ... [more] SANE2013-30
pp.87-90
SDM, ED
(Workshop)
2012-06-29
11:15
Okinawa Okinawa Seinen-kaikan [Invited Talk] Thermal-Aware Device Desing of Nanoscale MOS Transistors
Ken Uchida (Keio Univ.), Tsunaki Takahashi, Nobuyasu Beppu (Tokyo Tech)
The self-heating effects in Bulk/SOI FinFETs have been systematically investigated and compared. It is demonstrated that... [more]
ED, SDM 2007-06-25
13:00
Overseas Commodore Hotel Gyeongju Chosun, Gyeongju, Korea [Invited Talk] Requirements for Thin Film Transistor Circuits on Plastic
Mitsutoshi Miyasaka, Hiroyuki Hara, Nobuo Karaki, Satoshi Inoue (Seiko Epson)
The self-heating effect of thin film transistors (TFTs) is a serious problem when the TFT circuits are formed on a plast... [more]
EE, CPM 2005-01-21
13:40
Tokyo Kikai-Shinko-Kaikan Bldg. - -- - --
Kazutaka Yoshida (OMRON Co.)
In recent years, the demand of miniaturization of electric devices is increasing every year and the demand range has spr... [more] EE2004-53 CPM2004-148
pp.33-38
 Results 1 - 13 of 13  /   
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