Committee |
Date Time |
Place |
Paper Title / Authors |
Abstract |
Paper # |
EE, IEE-SPC |
2023-07-20 13:00 |
Hyogo |
(Primary: On-site, Secondary: Online) |
[Invited Talk]
Latest Trends in Automotive Power Electronics and Application of Magnetic Components Jun Imaoka (NU) EE2023-9 |
Recently, achieving carbon neutrality which means balancing CO2 emissions and absorption is a global concern. Especially... [more] |
EE2023-9 pp.1-50 |
MW |
2023-05-18 14:45 |
Kyoto |
Ritsumeikan University (Primary: On-site, Secondary: Online) |
A Basic Study of a Heat dissipation 8-way Waveguide Power Combiner Akimichi Hirota, Takeshi Oshima, Jun Nishihara, Hiroyuki Nonomura, Toru Fukasawa, Yoshio Inasawa (Mitsubishi Electric Corp.) MW2023-9 |
A coaxial to waveguide transition is used when signals are transmitted with low loss. When a large power is input to the... [more] |
MW2023-9 pp.1-5 |
CCS |
2023-03-27 09:00 |
Hokkaido |
RUSUTSU RESORT |
Medical Image Segmentation with Inverse Heat Dissipation Model Yu Kashihara, Takashi Matsubara (Osaka Univ.) CCS2022-82 |
The diffusion model is a generative model based on stochastic transitions and has been successfully used to generate
an... [more] |
CCS2022-82 pp.107-112 |
MW |
2022-05-20 10:00 |
Kyoto |
Kyoto Univ. (Primary: On-site, Secondary: Online) |
A Basic Study of a Heat dissipation Coaxial to Waveguide Transition Akimichi Hirota, Takeshi Oshima, Jun Nishihara, Hiroyuki Nonomura, Toru Fukasawa, Yoshio Inasawa (Mitsubishi Electric) MW2022-16 |
A coaxial to waveguide transition is used when signals are transmitted with low loss. When a large power is input to the... [more] |
MW2022-16 pp.8-12 |
MW |
2022-03-03 09:35 |
Online |
Online |
Chip Resistors for Heat Dissipation on RF circuits Yuta Sugiyama, Hidenori Ishibashi, Takeshi Oshima, Hidenori Yukawa, Toru Fukasawa, Toru Takahashi, Yoshio Inasawa (Mitsubishi Electric) MW2021-112 |
In this paper we present that the technology of heat dissipation for RF circuit using chip resistors. The quarter wavele... [more] |
MW2021-112 pp.7-11 |
WPT |
2020-12-08 14:20 |
Online |
Online |
Development of Power Transmitter for the 24GHz-Band WiCoPT System and the Power Transmission Experiment Kota Kinugawa, Toshio Ishizaki, Takayuki Matsumuro (Ryukoku Univ.) WPT2020-29 |
A 24GHz band WiCoPT (Wireless Communication and Power Transmission) demo system has been developed for battery-less sens... [more] |
WPT2020-29 pp.17-20 |
MSS, CAS, SIP, VLD |
2020-06-18 14:25 |
Online |
Online |
Thermal transient analysis of the heat generation and design of temperature control circuit in three-dimensional stacked chip Tomoaki Oikawa, Kimiyoshi Usami (Shibaura Inst. of Tech.) CAS2020-9 VLD2020-9 SIP2020-25 MSS2020-9 |
As a technology for improving the degree of integration of LSI, there is a three-dimensional stacking technology of LSI ... [more] |
CAS2020-9 VLD2020-9 SIP2020-25 MSS2020-9 pp.47-52 |
HWS, VLD |
2019-02-28 10:00 |
Okinawa |
Okinawa Ken Seinen Kaikan |
Thermal transient analysis and evaluation of the heat generation and dissipation in three-dimensional stacked LSI Ryota Horigome, Kimiyoshi Usami (Shibaura Inst. of Tech.) VLD2018-107 HWS2018-70 |
As a technology for improving the degree of integration of LSI, there is a three-dimensional stacking technology of LSI ... [more] |
VLD2018-107 HWS2018-70 pp.85-90 |
SDM, ICD, ITE-IST [detail] |
2017-08-02 10:50 |
Hokkaido |
Hokkaido-Univ. Multimedia Education Bldg. |
[Invited Talk]
Capacitor-less neuron circuits using metal-insulator transition devices Takeaki Yajima, Tomonori Nishimura, Akira Toriumi (Univ. of Tokyo) SDM2017-44 ICD2017-32 |
The metal-insulator transition of VO2 is exploited in neuromorphic circuits, resulting in a capacitor-less neuron circui... [more] |
SDM2017-44 ICD2017-32 pp.107-108 |
SANE |
2013-06-21 14:55 |
Ibaraki |
Tsukuba Space Center, JAXA |
Development and Results of On-orbit Experiment of Flat-plate Heat Pipe onboard SDS-4 Makiko Ando, Atsushi Okamoto, Masakatsu Maeda, Hiroyuki Sugita (JAXA) SANE2013-30 |
An Oscillating heat pipe (OHP), which is a thin heat transfer device with high heat transfer capability, is expected to ... [more] |
SANE2013-30 pp.87-90 |
SDM, ED (Workshop) |
2012-06-29 11:15 |
Okinawa |
Okinawa Seinen-kaikan |
[Invited Talk]
Thermal-Aware Device Desing of Nanoscale MOS Transistors Ken Uchida (Keio Univ.), Tsunaki Takahashi, Nobuyasu Beppu (Tokyo Tech) |
The self-heating effects in Bulk/SOI FinFETs have been systematically investigated and compared. It is demonstrated that... [more] |
|
ED, SDM |
2007-06-25 13:00 |
Overseas |
Commodore Hotel Gyeongju Chosun, Gyeongju, Korea |
[Invited Talk]
Requirements for Thin Film Transistor Circuits on Plastic Mitsutoshi Miyasaka, Hiroyuki Hara, Nobuo Karaki, Satoshi Inoue (Seiko Epson) |
The self-heating effect of thin film transistors (TFTs) is a serious problem when the TFT circuits are formed on a plast... [more] |
|
EE, CPM |
2005-01-21 13:40 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
-
-- - -- Kazutaka Yoshida (OMRON Co.) |
In recent years, the demand of miniaturization of electric devices is increasing every year and the demand range has spr... [more] |
EE2004-53 CPM2004-148 pp.33-38 |