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All Technical Committee Conferences (Searched in: All Years)
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Search Results: Conference Papers |
Conference Papers (Available on Advance Programs) (Sort by: Date Descending) |
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Committee |
Date Time |
Place |
Paper Title / Authors |
Abstract |
Paper # |
CPM |
2023-07-31 14:40 |
Hokkaido |
(Primary: On-site, Secondary: Online) |
Evaluation of VUV Absorption Characteristics in Surface Modification of Dielectric Resin Materials by VUV Light Shinichi Endo, Yuki Ishikawa (Osaka Prefecture University), Hina Shirakashi, Takeyasu Saito (Osaka Metropolitan univ.) CPM2023-13 |
Since resin generally absorbs vacuum ultraviolet (VUV) light well, it is thought that the VUV light reaching the inside ... [more] |
CPM2023-13 pp.7-10 |
EMD, R |
2017-02-17 16:00 |
Shiga |
Omuron Kusatsu Factory |
Study on the Relation between Filler of the Adhesive and Functions of Mechanical Devices Osmau Ohtani, Tomohiro Fukuhara (Omron Corp.) R2016-68 EMD2016-95 |
The adhesives for the mechanical device such as Relay or Switch are required the tracking resistance, the contact reliab... [more] |
R2016-68 EMD2016-95 pp.49-52 |
MW |
2013-12-19 15:55 |
Saitama |
Saitama Univ. |
Observation of Temperature Changes of Carbon Nanotube Doped Epoxy Resin under Millimeter-Wave Irradiation Kensuke Tamura, Masaki Tanaka (Akita NCT) MW2013-161 |
Recently, carbon nanotube (CNT) is attractive material as radio wave absorber for microwave and millimeter-wave. In this... [more] |
MW2013-161 pp.59-64 |
OME |
2010-10-22 14:15 |
Tokyo |
NTT Musashino R&D Center |
Vapor deposition polymerization of epoxy polymer thin films Shigekazu Fukui (Tokyo Univ. Agricul. & Technol.), Akio Sugiura, Akira Shintai, Kazuo Kato (DENSO), Kuniaki Tanaka, Hiroaki Usui (Tokyo Univ. Agricul. & Technol.) OME2010-49 |
Thin films of epoxy resin were deposited by vapor deposition polymerization, coevaporating diepoxide monomer and diamine... [more] |
OME2010-49 pp.15-20 |
EMD, R |
2010-02-19 13:00 |
Osaka |
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A Study on Improvement for Seal property of Electromechanical Devices
-- The behavior of One-Part Epoxy Resin in a narrow gap -- Osamu Otani, Seiji Nakajima, Tomohiro Fukuhara (OMRON Corp.) R2009-51 EMD2009-118 |
Generally, one-part epoxy resin consists of liquid epoxy monomer, solid curing agent, and filler as a packing agent and ... [more] |
R2009-51 EMD2009-118 pp.7-11 |
EMD |
2009-10-30 17:05 |
Tokyo |
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The Influence of Afhesives for Heat Resistant Sealing Characteristic for Relay Tomohiro Fukuhara (OMRON Corp.) EMD2009-67 |
In recent years, electronics components has a trend of increasing Surface Mount type because of needs for densely array ... [more] |
EMD2009-67 pp.51-56 |
OPE, EMD, CPM, LQE |
2009-08-21 16:15 |
Miyagi |
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Adhesive Technology of Electronics Devices Tomohiro Fukuhara (OMRON Corp.) EMD2009-56 CPM2009-80 OPE2009-104 LQE2009-63 |
Relays are used for various purposes, and are demand for high reliability. Especially, Sealing relays are packaged with ... [more] |
EMD2009-56 CPM2009-80 OPE2009-104 LQE2009-63 pp.157-162 |
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