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 Conference Papers (Available on Advance Programs)  (Sort by: Date Descending)
 Results 21 - 40 of 121 [Previous]  /  [Next]  
Committee Date Time Place Paper Title / Authors Abstract Paper #
OFT 2020-10-09
14:30
Online Online Interferometer based on photonic integrated circuit for optical frequency domain reflectometry
Victor Shishkin, Akio Higo, Hideaki Murayama (UTokyo) OFT2020-34
We demonstrate an ultra-compact interferometer integrated on silicon photonic chip for distributed sensing using optical... [more] OFT2020-34
pp.109-111
IT 2020-09-04
09:40
Online Online A Study on Chip-Pair Codes for Synchronous Optical CDMA Systems
Tomoko K. Matsushima, Shoichiro Yamasaki, Kyohei Ono (Polytechnic Univ.) IT2020-19
This paper proposes a class of chip-pair codes for synchronous optical code-division multiple access (CDMA) and shows a ... [more] IT2020-19
pp.7-12
MICT, WBS 2020-07-21
13:00
Online Online Study on Construction of Generalized Modified Prime Sequence Codes -- Proposal and Applications of Chip-Pair Codes --
Tomoko K. Matsushima, Shoichiro Yamasaki, Kyohei Ono (Polytechnic Univ.) WBS2020-2 MICT2020-1
This paper proposes a concept of chip-pair codes for synchronous optical code-division multiple access (CDMA) and shows ... [more] WBS2020-2 MICT2020-1
pp.1-6
VLD, DC, CPSY, RECONF, ICD, IE, IPSJ-SLDM, IPSJ-EMB, IPSJ-ARC
(Joint) [detail]
2019-11-14
10:05
Ehime Ehime Prefecture Gender Equality Center DNN accelerator for AI edge computing
Yasuhiro Nakahara, Juntaro Chikama, Motoki Amagasaki (Kumamoto Univ.), Zhao Qian (Kyutech), Masahiro Iida (Kumamoto Univ.) RECONF2019-38
Convolutional Neural Network (CNN), a kind of artificial intelligence for image recognition, is used in
various fields ... [more]
RECONF2019-38
pp.15-20
EST 2019-05-17
14:40
Aichi Nagoya Inst. Tech. Dielectric Constant Change of Silicon Substrate after H/He Ion Irradiation for Loss Reduction
Takuichi Hirano (Tokyo City Univ.), Maya Mizuno (NICT), Ning Li (Sophia Univ.), Takeshi Inoue, Masatsugu Sogabe (SHI-ATEX), Kenichi Okada (Tokyo Tech.) EST2019-5
The hydrogen (H) or helium (He) ion irradiation on a silicon (Si) substrate had been proposed to reduce loss in high fre... [more] EST2019-5
pp.19-23
CPSY, DC, IPSJ-SLDM, IPSJ-EMB, IPSJ-ARC [detail] 2019-03-17
16:10
Kagoshima Nishinoomote City Hall (Tanega-shima) Design of Vector Unit for AI Acceleration in Embedded Processor
Yosuke Ide, Hiromi Suzuki, Yuki Mori, Nobuyuki Yamasaki (Keio Univ.) CPSY2018-107 DC2018-89
In recent years, AI is applied in wide range of fields. Its learning and recognition are based on Neural Network (NN), w... [more] CPSY2018-107 DC2018-89
pp.167-172
ASN, MoNA, IPSJ-MBL, IPSJ-UBI [detail] 2019-03-05
14:00
Tokyo The University of Tokyo, Komaba Campus Development of Doppler CSI model for Wi-Fi based hand gesture detection application
Nopphon Keerativoranan, Jun-ichi Takada (TiTech) ASN2018-111
Various studies have proposed the use of RF signals to realize a non-wearable hand gesture sensing applications in the e... [more] ASN2018-111
pp.175-180
DC 2019-02-27
10:55
Tokyo Kikai-Shinko-Kaikan Bldg. Efficient Challenge-Response Pairs Generation and Evaluation for PUF Circuit Using BIST Circuit During Manufacturing Test
Tomoki Mino, Shintani Michihiro, Michiko Inoue (NAIST) DC2018-75
Recently, counterfeited ICs have become a big problem for semiconductor supply chains. One of the countermeasures for th... [more] DC2018-75
pp.25-30
HWS, VLD 2019-03-01
14:30
Okinawa Okinawa Ken Seinen Kaikan Integrated Circuit Design and Evaluation of Chip-Package-Board Interactive PUF Based on Wireless Chaos Oscillation
Masanori Takahashi, Makoto Nagata, Noriyuki Miura (Kobe Univ.) VLD2018-130 HWS2018-93
We proposed chip-package-board interactive PUF using chaos oscillation that is compatible with wireless coupling as a co... [more] VLD2018-130 HWS2018-93
pp.223-224
SDM 2019-02-07
16:10
Tokyo   [Invited Talk] Fabrication of substrates with smooth Au surface for bonding at room temperature in atmospheric air
Takashi Matsumae, Michitaka Yamamoto, Yuichi Kurashima, Eiji Higurashi, Hideki Takagi (AIST) SDM2018-97
e electroformed a Cu-based heat spreader with smooth Au thin film for room temperature bonding in atmospheric air. The C... [more] SDM2018-97
pp.27-30
MW 2018-11-16
11:30
Nagasaki Fukue Cultural Hall Realization of Flat Passband Characteristics for BPF Using Resistor Loaded Hairpin Shaped Resonators
Tomohiro Tsukushi, Satoshi Ono, Koji Wada (UEC) MW2018-109
In this study, firstly, the single mode resistor loaded hairpin shaped resonator is proposed. It is shown using some equ... [more] MW2018-109
pp.89-94
ICD, CPSY, CAS 2017-12-14
09:30
Okinawa Art Hotel Ishigakijima Chip-Package-Board Interactive PUF Based on Chaos Oscillation
Masanori Takahashi, Kohei Matsuda, Makoto Nagata, Noriyuki Miura (Kobe Univ.) CAS2017-63 ICD2017-51 CPSY2017-60
This paper presents a new concept of PUF based on a chaotic behavior. Chaos is essentially not a random phenomenon but a... [more] CAS2017-63 ICD2017-51 CPSY2017-60
pp.1-2
VLD 2017-03-02
13:55
Okinawa Okinawa Seinen Kaikan [Invited Talk] IP Timing Constraints Promotion Challenges -- A method to automatically generate SoC Timing Constraints --
Tatsuya Nakae, Ichiro Shiihara (Socionext) VLD2016-116
It is common that recent SoC is integrated with more than 10 functional IPs which are not only in-house designs but also... [more] VLD2016-116
p.81
VLD 2017-03-02
15:25
Okinawa Okinawa Seinen Kaikan Optimum Temperature Dependent Timing Skew for Temperature Aware Design
Makoto Soga, Mineo Kaneko (JAIST) VLD2016-119
Electric devices equipping LSIs are widely distributed everywhere on the earth and the space, and LSIs are demanded to o... [more] VLD2016-119
pp.91-96
VLD 2017-03-03
13:25
Okinawa Okinawa Seinen Kaikan Effect on the Chip Area of Component Adjacency Constraint for Soft-Error Tolerant Datapaths
Junghoon Oh, Mineo Kaneko (JAIST) VLD2016-129
Due to the downsizing of VLSI, reliability issues caused by soft-errors have become more explicit. Several studies in sy... [more] VLD2016-129
pp.151-156
EMCJ, IEE-EMC, MW, EST [detail] 2016-10-20
10:55
Miyagi Tohoku Univ. 4-Channel Transmit/Receive RF Core-Chip for High SHF Wide-band Massive MIMO in 5G
Wataru Yamamoto, Koji Tsutsumi, Takaya Maruyama, Takanobu Fujiwara, Ichiro Somada, Tatsuya Hagiwara, Eiji Taniguchi, Mitsuhiro Shimozawa (Mitsubishi Electric Corp.) EMCJ2016-63 MW2016-95 EST2016-59
In 5th generation mobile communication system (5G), the active phased array antenna (APAA) have attracted attention to r... [more] EMCJ2016-63 MW2016-95 EST2016-59
pp.21-24
MW
(2nd)
2016-06-09
- 2016-06-11
Overseas KMUTNB, Bangkok, Thailand Gain Enhancement of 140 GHz CMOS On-chip Antenna with Optimal Ion-Irradiated-Silicon
Junji Sato, Tomohiro Murata (Panasonic)
This paper presents the gain enhancement techniques for a 140 GHz CMOS on-chip antenna. The proposed CMOS on-chip folded... [more]
SDM, OME 2016-04-08
14:20
Okinawa Okinawa Prefectural Museum & Art Museum [Invited Talk] Growth and characterization of Sn-containing group-IV semiconductor thin film
Yosuke Shimura (Sizuoka Univ.), Wakana Takeuchi, Mitsuo Sakashita, Masashi Kurosawa, Osamu Nakatsuka, Shigeaki Zaima (Nagoya Univ.) SDM2016-5 OME2016-5
Strain and energy band structure can be designed in Sn-containing group-IV semiconductor alloys. Moreover, as these new ... [more] SDM2016-5 OME2016-5
pp.23-26
CS, OCS
(Joint)
2016-01-22
13:55
Kagoshima Kagoshima University, Korimoto Campus, Inamori Auditorium 2-Step Adaptive Equalization Scheme Based on Spectrum Monitoring implemented in Frequency-Domain Equalizer
Hidemi Noguchi, Wakako Maeda, Emmanuel Le Taillandier de Gabory, Sadao Fujita, Tatsuya Nakamura, Jun'ichi Abe, Kiyoshi Fukuchi (NEC) OCS2015-99
Adaptive equalization techniques for mitigation of transmission impairments, such as spectrum narrowing in ROADM (Reconf... [more] OCS2015-99
pp.63-68
ICD, ITE-IST 2015-07-03
16:10
Kanagawa National Defense Academy [Invited Talk] Photovoltaic-Assisted CMOS Rectifier for Highly Efficient Energy Harvesting from Radio Waves
Koji Kotani (Tohoku Univ.) ICD2015-24
As one example realization of the synergistic energy harvesting concept, photovoltaic (PV)-assisted CMOS rectifier techn... [more] ICD2015-24
pp.59-64
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