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All Technical Committee Conferences (Searched in: All Years)
| Committee | Date Time | Place | Paper Title / Authors | Abstract | Paper # | |
| RCS, SR, SRW (Joint) |
2015-03-04 14:45 |
Tokyo | Tokyo Institute of Technology | [Panel Discussion]
Activities of KKE regarding visualization of analysis for wireless technologies Yukiko Kishiki (KKE)  SR2014-121 SRW2014-47 |
Compared to a decage ago, radiowaves have become a familiar phenomenon in our daily lives. But since it is invisible, i... [more] |
SR2014-121 SRW2014-47 pp.61-62(SR), pp.9-10(SRW) |
| SDM | 2015-03-02 13:05 |
Tokyo | Kikai-Shinko-Kaikan Bldg | [Invited Talk]
Area dependence of thermal stability factor in perpendicular STT-MRAM analized by bi-directional data flipping model Koji Tsunoda, Masaki Aoki, Hideyuki Noshiro, Yoshihisa Iba, Chikako Yoshida, Yuuichi Yamazaki, Atsushi Takahashi, Akiyoshi Hatada, Masaaki Nakabayashi, Toshihiro Sugii (LEAP) SDM2014-166 |
We report a statistical analysis of the thermal stability factor (delta) for the top-pinned perpendicular magnetic tunne... [more] | SDM2014-166 pp.23-28 |
| EMCJ, IEE-EMC | 2014-12-19 11:40 |
Shizuoka | Shizuoka Univ. | Accuracy Improvement in the Analysis of Core Temperature Elevation in Adult Female and Infant for Far-Field Microwave Exposure Youhei Asano, Ilkka Laakso, Akimasa Hirata (Nagoya Inst. of Tech.) EMCJ2014-79 |
In recent years, with the development of the wireless communications technology, there is an increasing concern in the a... [more] | EMCJ2014-79 pp.31-35 |
| EMD | 2014-11-30 10:00 |
Hokkaido | Chitose Cultural Center | The influence of temperature and pressure on the contact resistance and its application in thermal analysis of low voltage circuit breaker Chunping Niu, Hui Chen, Yi Wu, Junxingxu Chen, Juwen Ding (Xi'an Jiaotong Univ.) EMD2014-82 |
Thermal analysis is significant to the design of circuit breaker. The contact resistance between moving contact and fixe... [more] | EMD2014-82 pp.99-103 |
| CAS, SIP, MSS, VLD, SIS [detail] | 2014-07-10 13:30 |
Hokkaido | Hokkaido University | Comparison Between Latency Insertion Method (LIM) and Relaxation Method in Thermal Analysis Kazuki Sakamoto, Tadatoshi Sekine, Hideki Asai (Shizuoka Univ.) CAS2014-28 VLD2014-37 SIP2014-49 MSS2014-28 SIS2014-28 |
This report makes a comparison of effectiveness between the latency insertion method (LIM) and a relaxation method for t... [more] | CAS2014-28 VLD2014-37 SIP2014-49 MSS2014-28 SIS2014-28 pp.147-152 |
| MBE | 2014-06-13 15:45 |
Hokkaido | Hokkaido Univerisity | Using a thermal imaging sensor to detect falls during bathing Tomoya Miyasaka (Hokkaido Univ. of Science), Masanori Shoji (Little Snow), Toshiaki Tanaka (Univ. of Tokyo), Tadafumi Saga (Chino), Hirokazu Haruna, Takumi Ino, Yoshimi Tanahashi, Shiho Namba, Masaji Yamashita (Hokkaido Univ. of Science) MBE2014-25 |
The study investigated a system that uses a thermal-imaging sensor to ensure safety by detecting falls during and bathin... [more] | MBE2014-25 pp.63-66 |
| EMD | 2014-01-31 14:50 |
Tokyo | A Study of Thermal Deformation of box type resin part in Reflow Process Masayuki Tamura, Toshiyuki Shimoda (JAE) EMD2013-139 |
LCP is used many of Insulator(INS) materials. Resins of LCP have the big anisotropy of the coefficient of thermal expans... [more] | EMD2013-139 pp.17-22 |
|
| SDM | 2013-12-13 09:00 |
Nara | NAIST | Analysis of thermal-induced degradation in oxide thin-film transistor under pulse voltage stress Kahori Kise (NAIST), Shigekazu Tomai (Idemitsu Kosan), Yoshihiro Ueoka, Haruka Yamazaki, Satoshi Urakawa (NAIST), Koki Yano (Idemitsu Kosan), Dapeng Wang, Mamoru Furuta (Kochi Univ. of Tech.), Masahiro Horita, Yasuaki Ishikawa, Yukiharu Uraoka (NAIST) SDM2013-116 |
In recent years, transparent amorphous oxide semiconductor (TAOS), represented by a-InGaZnO have been reported. Because ... [more] | SDM2013-116 pp.1-5 |
| MRIS, ITE-MMS | 2013-12-13 10:15 |
Ehime | Ehime Univ. | Recording field analysis of a magnetic write head for thermally-assisted magnetic recording assuming shingled writing scheme Hidekazu Tamura, Yasushi Kanai (Niigata Inst. of Tech.), Kiyoshi Yamakawa (AIT), Kazuetsu Yoshida (Kogakuin Univ.), Simon Greaves, Hiroaki Muraoka (Tohoku Univ.) MR2013-33 |
Recording field analysis of magnetic recording head in thermally-assisted magnetic recording (TAMR). Static recording fi... [more] | MR2013-33 pp.49-54 |
| VLD, DC, IPSJ-SLDM, CPSY, RECONF, ICD, CPM (Joint) [detail] |
2013-11-28 10:55 |
Kagoshima | A thermal analysis algorithm for VLSI chip by GPGPU Takashi Ohmura, Lei Lin, Lin Meng, Masahiro Fukui (Ritsumeikan Univ.) VLD2013-89 DC2013-55 |
In recent years, since the heat problem of the circuit accompanying high integration of the circuit is remarkable, therm... [more] | VLD2013-89 DC2013-55 pp.209-214 |
|
| EMD | 2013-11-16 09:05 |
Overseas | Huazhong University of Science and Technology, Wuhan, P.R.China | Simulation and analysis of temperature field and thermal stress of composite contacts in electrical life test of DC relay Wenying Yang, Dongyuan Li (Harbin Inst. of Tech.), Zhuanke Chen (Chugai USA), Guofu Zhai (Harbin Inst. of Tech.) EMD2013-77 |
The dosage of precious metal and the cost can be efficiently reduced by using the composite contacts. Especially the AgM... [more] | EMD2013-77 pp.11-14 |
| OME, SDM | 2013-04-26 09:10 |
Kagoshima | Yakusima Environmental Culture Village Center | [Invited Talk]
Fabrication and Analysis of Organic LEDs and Solar Cells Hironori Kaji (Kyoto Univ.) SDM2013-9 OME2013-9 |
1) On bulk heterojunction organic solar cells (BHJ OSCs), it is found that thermal annealing treatment is an easy and in... [more] | SDM2013-9 OME2013-9 pp.43-48 |
| CQ, CS (Joint) |
2013-04-19 11:15 |
Niigata | Sado Island Development Center | A Water Retention Control System for Humidity Sensing at High Temperature Tetsuo Tsujioka, Hiroyuki Iyota, Masahito Ohmori, Junko Yamagata (Osaka City Univ.), Michiaki Tanaka, Haruo Kitamura (Miyagawa Kasei) CS2013-7 |
Nowadays, the temperature and humidity control of superheated steam have become important research area in food drier, p... [more] | CS2013-7 pp.35-41 |
| MBE, NC (Joint) |
2012-11-16 14:15 |
Miyagi | Tohoku University | Objective Evaluation of Somatic Sensation for Mechanical and Thermal Stimuli Ryuta Kon, Junichi Hori (Niigata Univ.) MBE2012-52 |
In clinical situations, lawsuits for nerve injuries and treatments of patients with temporomandibular joint have come to... [more] | MBE2012-52 pp.37-42 |
| EMD | 2012-10-19 14:25 |
Tokyo | Fuji Electric FA Components & Systems Co., Ltd. | Thermal analyses of electrical contacts by resistance welding CAE
-- (1) modeling and heat condition -- Koji Takami, Makoto Tsuchida (Omron) EMD2012-61 |
In the category of power relay, smaller contact diameter generally has a tendency toword lower electrical endurance. Ste... [more] | EMD2012-61 pp.7-12 |
| LQE, CPM, EMD, OPE, R | 2012-08-23 15:15 |
Miyagi | Tohoku Univ. | Current Injecting Operation and Thermal Analysis of GaInAsP/InP Membrane DFB Laser Kyohei Doi, Takahiko Shindo, Mitsuaki Futami, Tomohiro Amemiya, Nobuhiko Nishiyama, Shigehisa Arai (Tokyo Tech) R2012-29 EMD2012-35 CPM2012-60 OPE2012-67 LQE2012-33 |
We have proposed a semiconductor membrane distributed feedback (DFB) laser as a light source for on-chip optical interco... [more] | R2012-29 EMD2012-35 CPM2012-60 OPE2012-67 LQE2012-33 pp.41-46 |
| MRIS, ITE-MMS | 2012-03-16 15:45 |
Aichi | Nagoya Univ. | Heat analysis of recording head for thermally assisted magnetic recording Yoshito Ashizawa, Takeshi Ota, Katsuji Nakagawa (Nihon Univ.) MR2011-46 |
Thermally assisted magnetic recording is a key technology to achieve ultra-high recording density more than several $Tbi... [more] | MR2011-46 pp.33-37 |
| MW | 2011-11-25 14:00 |
Okinawa | Distortion Analysis of HBT Amplifier Applying RC-Ladder Thermal Memory Effect Compensation Circuit, and Parameter Determination Method of the Circuit Ryo Ishikawa, Junichi Kimura, Kazuhiko Honjo (UEC) MW2011-122 |
An analytical design method based on Taylor series including both electrical effects and thermal effects is presented fo... [more] | MW2011-122 pp.53-58 |
|
| ITE-ME, ITE-AIT, IE [detail] | 2011-11-11 14:25 |
Fukuoka | Micro-environment Thermal Analysis Based on Infrared Image Wuhe Zou (Tottori Univ.), Lei Zhang, Ning Dai (SITP), Shigang Li (Tottori Univ.) IE2011-87 |
In this paper we apply the thermal infrared imaging technology on the living thermal environment. Based on the infrared ... [more] | IE2011-87 pp.59-64 |
|
| SDM | 2011-07-04 15:40 |
Aichi | VBL, Nagoya Univ. | Hf and La upward diffusion into TiN electrode in TiN/HfLaSiO/SiO2 gate stacks induced by high-temperature annealing and its suppression with MIPS structure Yuki Odake, Hiroaki Arimura, Masayuki Saeki, Keisuke Chikaraishi, Naomu Kitano, Takuji Hosoi, Takayoshi Shimura, Heiji Watanabe (Osaka Univ.) SDM2011-65 |
We investigated Hf and La upward diffusion in TiN/HfLaSiO/SiO2 gate stacks by means of electrical characterization and X... [more] | SDM2011-65 pp.87-92 |
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