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All Technical Committee Conferences (Searched in: All Years)
| Committee | Date Time | Place | Paper Title / Authors | Abstract | Paper # | |
| SS, MSS | 2024-01-17 16:00 |
Ishikawa | (Primary: On-site, Secondary: Online) |
Linear Regression Analysis of the Fuel Cost Factors of The Concurrent Hydro-Thermal Corporation System Ichiro Toyoshima (Toshiba ESS), Tomoki Takeuchi, Ryoichi Hara (Hokkaido Univ.), Ryohei Momokawa (Toshiba ESS), Hiroyuki Kita (Hokkaido Univ.)  MSS2023-58 SS2023-37 |
In making a generation schedule, hydropower has played a central role in the power system. It is one of the effective wa... [more] | MSS2023-58 SS2023-37 pp.35-39 |
| QIT (2nd) |
2023-12-17 17:30 |
Okinawa | OIST (Primary: On-site, Secondary: Online) |
[Poster Presentation]
Optimal statistical ensembles for thermal state preparation Yasushi Yoneta (RIKEN) |
We develop efficient quantum algorithms for thermal state preparation by utilizing generalized ensembles. We provide a d... [more] | |
| MRIS, ITE-MMS | 2023-12-07 14:45 |
Ehime | Ehime Univ. (CITE) (Primary: On-site, Secondary: Online) |
Thermal Distributions of Recording Layers for in 3D Heat-assisted Magnetic Recording Koya Maeda, Fumiko Akagi (Kogakuin Univ) MRIS2023-25 |
In a 3D heat assisted magnetic recording method using a double-layer bit patterned medium (BPM), we investigated the rel... [more] | MRIS2023-25 pp.18-23 |
| EST, MW, EMT, OPE, MWPTHz, IEE-EMT [detail] | 2023-07-20 13:25 |
Hokkaido | Muroran Institute of Technology (Primary: On-site, Secondary: Online) |
Estimation of Thermal Perception Threshold using Multiphysics Analysis by Contact Current Shoya Kimura, Sachiko Kodera (NITech), Shintaro Uehara, Akiko Yuasa, Kazuki Ushizawa (FHU), Yoshitsugu Kamimura, Yohei Otaka (UU), Akimasa Hirata (NITech) EMT2023-16 MW2023-34 OPE2023-16 EST2023-16 MWPTHz2023-12 |
When the human body contacts with a metal with different electric potentials, electrical contact currents flow into the ... [more] | EMT2023-16 MW2023-34 OPE2023-16 EST2023-16 MWPTHz2023-12 pp.38-42 |
| CAS, SIP, VLD, MSS | 2022-06-16 16:10 |
Aomori | Hachinohe Institute of Technology (Primary: On-site, Secondary: Online) |
Dynamic Temperature Control Algorithm for 3-D Stacked Chips based on Thermal Analysis Songxiang Wang, Kimiyoshi Usami (Shibaura IT) CAS2022-10 VLD2022-10 SIP2022-41 MSS2022-10 |
The problem of heat generation is more serious in 3D stacked chips than in non-stacked counterparts. In this study, we f... [more] | CAS2022-10 VLD2022-10 SIP2022-41 MSS2022-10 pp.52-57 |
| MSS, CAS, SIP, VLD | 2020-06-18 14:25 |
Online | Online | Thermal transient analysis of the heat generation and design of temperature control circuit in three-dimensional stacked chip Tomoaki Oikawa, Kimiyoshi Usami (Shibaura Inst. of Tech.) CAS2020-9 VLD2020-9 SIP2020-25 MSS2020-9 |
As a technology for improving the degree of integration of LSI, there is a three-dimensional stacking technology of LSI ... [more] | CAS2020-9 VLD2020-9 SIP2020-25 MSS2020-9 pp.47-52 |
| SCE | 2020-01-17 13:15 |
Kanagawa | [Poster Presentation]
Analysis of the influence of 1/f noise on the operational stability of quantum flux parametron circuit Yusuke Tsuna, Yuki Yamanashi, Nobuyuki Yoshikawa (Yokohama Natl. Univ.) SCE2019-56 |
We analyzed influences of the 1/f noise in the superconducting circuit on the operation. We devised a circuit simulation... [more] | SCE2019-56 pp.107-109 |
|
| NC, MBE | 2019-12-06 13:25 |
Aichi | Toyohashi Tech | Proposal of Region Segmentation Algorithm for Facial Thermal Image Using Eigenfaces Yuki Hasumi, Kosuke Oiwa, Akio Nozawa (Aoyama Gakuin Univ.) MBE2019-62 NC2019-53 |
In late years, facial skin temperature acquired non-catalytically by using thermal cameras is suggested as one of the no... [more] | MBE2019-62 NC2019-53 pp.101-105 |
| HWS, VLD | 2019-02-28 10:00 |
Okinawa | Okinawa Ken Seinen Kaikan | Thermal transient analysis and evaluation of the heat generation and dissipation in three-dimensional stacked LSI Ryota Horigome, Kimiyoshi Usami (Shibaura Inst. of Tech.) VLD2018-107 HWS2018-70 |
As a technology for improving the degree of integration of LSI, there is a three-dimensional stacking technology of LSI ... [more] | VLD2018-107 HWS2018-70 pp.85-90 |
| EMD | 2018-11-09 15:05 |
Tokyo | The University of Electro-Communications | Evolution of contact surface of closed Cu rivets carrying large current Xue Zhou, Kai Bo, Guofu Zhai (Harbin Inst. Tech) EMD2018-44 |
The mechanism of contact surface of closed Cu rivets are significant to the static welding caused by carrying large curr... [more] | EMD2018-44 pp.21-25 |
| ED, SDM | 2018-02-28 15:50 |
Hokkaido | Centennial Hall, Hokkaido Univ. | Construction of simulation for analyzing thermal conduction in nanostructures Naomi Yamashita, Yuya Ota, Ryo Nanao, Hiroshi Inokawa, Masaru Shimomura, Kenji Murakami, Hiroya Ikeda (Shizuoka Univ.) ED2017-112 SDM2017-112 |
With the aim of characterizing the thermal conductivity for nanometer-scale thermoelectric materials, we have constructe... [more] | ED2017-112 SDM2017-112 pp.35-38 |
| ICD, CPSY, CAS | 2017-12-14 10:40 |
Okinawa | Art Hotel Ishigakijima | Performance Analysis of Level-Cross Detection Method based on Stochastic Comparator Taiki Sugiyama, Tetsuya Iizuka (Univ. of Tokyo), Takahiro Yamaguchi (Advantest), Toru Nakura, Kunihiro Asada (Univ. of Tokyo) CAS2017-66 ICD2017-54 CPSY2017-63 |
ADC based on level-cross detection quantizes time rather than voltage. When the clock frequency is doubled, SNR of ADC i... [more] | CAS2017-66 ICD2017-54 CPSY2017-63 pp.15-20 |
| MBE, NC (Joint) |
2017-05-26 14:55 |
Toyama | Toyama Prefectural Univ. | Extraction of Diurnal Variations Based on Facial Skin Temperature by Independent Component Analysis Hiroki Ito, Shizuka Bando, Kosuke Oiwa, Akio Nozawa (AGU) MBE2017-6 |
Facial skin temperature has been used for evaluating of temporal psychophysiological states. On the other hand, circadia... [more] | MBE2017-6 pp.27-32 |
| EMD, R | 2017-02-17 17:00 |
Shiga | Omuron Kusatsu Factory | Report on thermal simulation technique to analyze effect of contact bounce arc. Kazua Murakami, Takeshi Nishida (Omron), Tetsuo Shinkai (OER) R2016-71 EMD2016-98 |
We report a thermal analysis method to quantify the melting phenomenon of the contact which causes the contact welding p... [more] | R2016-71 EMD2016-98 pp.65-70 |
| CPSY, RECONF, VLD, IPSJ-SLDM, IPSJ-ARC [detail] | 2017-01-25 10:55 |
Kanagawa | Hiyoshi Campus, Keio Univ. | Thermal transient analysis and evaluation of three-dimensional stacked chips Shogo Yasuda, Kimiyoshi Usami (SIT) VLD2016-98 CPSY2016-134 RECONF2016-79 |
There is a three-dimensional stacking technology of LSI in technology for improving the density of LSI. Three-dimensiona... [more] | VLD2016-98 CPSY2016-134 RECONF2016-79 pp.181-186 |
| ASN, MoNA, MICT (Joint) |
2017-01-20 14:40 |
Oita | Defect Causal Analysis in Solar Panel using Thermal Image : A Deep Learning Approach Seungho Lee, Makoto Suzuki, Hiroyuki Morikawa (UTokyo) ASN2016-87 |
Deteriorated solar panels cause not only decreasing of power generation but also significantly safety concerns such as c... [more] | ASN2016-87 pp.95-100 |
|
| ICD, CPSY | 2016-12-16 16:10 |
Tokyo | Tokyo Institute of Technology | Analysis of Wide-Range-Temperature Compensation Using Isothermal-Point and Back-Gate-Bias-Control for ISFET-Array Makoto Ogi, Zule Xu, Takayuki Kawahara (TUS) ICD2016-99 CPSY2016-105 |
pH sensors using ion-sensitive field effect transistors (ISFETs) are sensitive to temperature variation, which limits th... [more] | ICD2016-99 CPSY2016-105 pp.155-160 |
| VLD, CAS, MSS, SIP | 2016-06-17 15:30 |
Aomori | Hirosaki Shiritsu Kanko-kan | Thermal Analysis in 3D ICs Kaoru Furumi, Masashi Imai, Nanako Niioka, Atsushi Kurokawa (Hirosaki Univ.) CAS2016-32 VLD2016-38 SIP2016-66 MSS2016-32 |
Three-dimensional integrated circuits (3D ICs) lead to higher power densities than 2D ICs because of the stacking of mul... [more] | CAS2016-32 VLD2016-38 SIP2016-66 MSS2016-32 pp.173-178 |
| VLD, DC, IPSJ-SLDM, CPSY, RECONF, ICD, CPM (Joint) [detail] |
2015-12-03 11:15 |
Nagasaki | Nagasaki Kinro Fukushi Kaikan | Construction and Evaluation of Three-Dimensional Heat Transfer Simulator for LSI Packages Shougo Watanabe, Takashi Omura, Yuki Kitagawa, Lei Lin, Lin Meng, Masahiro Fukui (Ritsumeikan Univ.) VLD2015-64 DC2015-60 |
In this study, we consider the thermal distribution in three-dimensional, and we tried the efficiency of analytical calc... [more] | VLD2015-64 DC2015-60 pp.171-176 |
| SDM | 2015-06-19 15:50 |
Aichi | VBL, Nagoya Univ. | Fully compatible resistive random access memory with amorphous InGaZnO based thin film transistor fabrication process Keisuke Kado, Mutsunori Uenuma, Kyouhei Nabesaka, Kriti Sharma, Haruka Yamazaki, Satoshi Urakawa, Mami Fujii, Yasuaki Ishikawa, Yukiharu Uraoka (NAIST) SDM2015-52 |
a-InGaZnO based non-volatile memories were fabricated as resistive random access memory (ReRAM) for use in System on Pan... [more] | SDM2015-52 pp.75-80 |
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