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All Technical Committee Conferences (Searched in: All Years)
| Committee | Date Time | Place | Paper Title / Authors | Abstract | Paper # | |
| SC | 2024-03-08 15:35 |
Tokyo | NII (Primary: On-site, Secondary: Online) |
Learning Application for 3D Rendering Library Three.js
-- Digital Transformation for Programming Education -- Nobuyuki Tabuchi, Hiroshi Sunaga (OIT)  SC2023-39 |
This paper introduces a ChatGPT-aided learning support application that aims to facilitate personalized learning, focusi... [more] | SC2023-39 pp.27-32 |
| SDM | 2024-02-21 14:10 |
Tokyo | Tokyo University-Hongo-Engineering Bldg.4 (Primary: On-site, Secondary: Online) |
[Invited Talk]
Optimization of Pre-Bonding Surface for Cu/SiCN Hybrid Bonding Kohei Nakayama, Kenta Hayama, Yutesu Kamiya, Fmihiro Inoue (YNU) SDM2023-85 |
Hybrid bonding is considered the key enabler for advanced chiplet integration, which requires finer pitch vertical conne... [more] | SDM2023-85 pp.20-26 |
| SDM | 2023-02-07 14:00 |
Tokyo | Tokyo Univ. (Primary: On-site, Secondary: Online) |
[Invited Talk]
Applications of the surface activated bonding on heterogeneous Integration at room temperature Tadatomo Suga (Meisei Univ.) SDM2022-89 |
The potential application of surface-activated junction (SAB) to semiconductor 3D hetero-integration is presented. In pa... [more] | SDM2022-89 pp.17-22 |
| EE, OME, CPM | 2022-12-09 11:20 |
Tokyo | (Primary: On-site, Secondary: Online) |
Investigation for one-chip high functionality gate driver IC Yusuke Ogushi, Satoshi Matsumoto (KIT) EE2022-22 CPM2022-77 OME2022-35 |
GaN power devices have caught the attentions for high frequency switching and high efficiency of power supply. Our goal ... [more] | EE2022-22 CPM2022-77 OME2022-35 pp.18-23 |
| ICD, SDM, ITE-IST [detail] | 2022-08-08 09:15 |
Online | [Invited Talk]
A 2-Layer Transistor Pixel Stacked CMOS Image Sensor with Oxide Based Full Trench Isolation for Large Full Well Capacity and High Quantum Efficiency Koichiro Zaitsu, Akira Matsumoto, Mizuki Nishida, Yusuke Tanaka, Hirofumi Yamashita, Yosuke Satake (Sony Semiconductor Solutions), Takashi Watanabe, Kunihiko Araki, Naoki Nei (Sony Semiconductor Manufacturing), Keiichi Nakazawa, Junpei Yamamoto, Mutsuo Uehara (Sony Semiconductor Solutions), Hiroyuki Kawashima, Yusaku Kobayashi (Sony Semiconductor Manufacturing), Tomoyuki Hirano, Keiji Tatani (Sony Semiconductor Solutions) SDM2022-33 ICD2022-1 |
(To be available after the conference date) [more] | SDM2022-33 ICD2022-1 pp.1-6 |
|
| SDM | 2022-02-04 11:20 |
Online | Online | [Invited Talk]
3D Sequential Process Integration for CMOS Image Sensor Keiichi Nakazawa, Junpei Yamamoto, Nobutoshi Fujii, Mutsuo Uehara, Katsunori Hiramatsu, Hideomi Kumano, Shigetaka Mori, Shintaro Okamoto, Akito Shimizu, Koichi Baba, Hidetoshi Onuma, Akira Matsumoto, Koichiro Zaitsu, Keiji Tanani, Tomoyuki Hirano, Hayato Iwamoto (Sony Semiconductor Solutions) SDM2021-77 |
We developed a new structure of pixel transistors stacked over photodiode named “2-Layer Transistor Pixel Stacked CMOS I... [more] | SDM2021-77 pp.13-16 |
| SDM | 2022-01-31 16:00 |
Online | Online | [Invited Talk]
**** Keiichi Nakazawa, Junpei Yamamoto, Shigetaka Mori, Shintaro Okamoto, Akito Shimizu, Koichi Baba, Nobutoshi Fujii, Mutsuo Uehara, Katsunori Hiramatsu, Hideomi Kumano, Akira Matsumoto, Koichiro Zaitsu, Hidetoshi Ohnuma, Keiji Tatani, Tomoyuki Hirano, Hayato Iwamoto (Sony Semiconductor Solutions) SDM2021-73 |
We developed a new structure of pixel transistors stacked over photodiode named “2-Layer Transistor Pixel Stacked CMOS I... [more] | SDM2021-73 pp.20-23 |
| EE | 2022-01-28 14:45 |
Online | Online | Numerical investigations of fully integrated transformerless floating gate driver IC Yusuke Ogushi, Satoshi Matsumoto (KIT) EE2021-49 |
One of the key issues of the floating gate driver circuit are to reduce the volume. To eliminate the transformer is one ... [more] | EE2021-49 pp.100-105 |
| SDM | 2021-02-05 16:00 |
Online | Online | [Invited Talk]
R&D of 3D-IC Technology in the era of AI, IoT, Big data Katsuya Kikuchi (AIST) SDM2020-60 |
3D integration is one of the most important technologies for developing new-generation electronics devices. In this arti... [more] | SDM2020-60 pp.23-26 |
| SDM | 2021-02-05 16:40 |
Online | Online | [Invited Talk]
Bumpless Build Cube (BBCube) using Wafer-on-Wafer (WOW) Technology with 3D Redundancy Scheme Shinji Sugatani, Norio Chujo, Koji Sakui, Hiroyuki Ryoson, Tomoji Nakamura, Takayuki Ohba (Titech) SDM2020-61 |
An application of vertically replaceable memory block architecture scheme hereinafter referred to as “3D redundancy” fo... [more] |
SDM2020-61 pp.27-32 |
| SDM | 2020-10-22 10:50 |
Online | Online | High capacitance density high breakdown voltage textured deep trench SiN capacitors toward 3D integration Koga Saito, Ayano Yoshida, Rihito Kuroda (Tohoku Univ.), Hiroshi Shibata, Taku Shibaguchi, Naoya kuriyama (LAPIS Semiconductor Miyagi), Shigetoshi Sugawa (Tohoku Univ.) SDM2020-15 |
High capacitance density and High breakdown voltage textured deep trench SiN capacitors are presented. The developed cap... [more] | SDM2020-15 pp.7-11 |
| MSS, CAS, SIP, VLD | 2020-06-18 14:25 |
Online | Online | Thermal transient analysis of the heat generation and design of temperature control circuit in three-dimensional stacked chip Tomoaki Oikawa, Kimiyoshi Usami (Shibaura Inst. of Tech.) CAS2020-9 VLD2020-9 SIP2020-25 MSS2020-9 |
As a technology for improving the degree of integration of LSI, there is a three-dimensional stacking technology of LSI ... [more] | CAS2020-9 VLD2020-9 SIP2020-25 MSS2020-9 pp.47-52 |
| SDM | 2020-02-07 14:55 |
Tokyo | Tokyo University-Hongo | [Invited Talk]
A THIN BONDING MATERIAL FOR HIGH DENSITY HETEROGENEOUS INTEGRATION Yasuhisa Kayaba, Yuzo Nakamura, Jun Kamada, Takashi Kozeki, Kazuo Kohmura (MCI) SDM2019-95 |
A new thin bonding material was developed for the heterogeneous device chip integration by Cu-Cu hybrid bonding. The bon... [more] | SDM2019-95 pp.31-34 |
| VLD, DC, CPSY, RECONF, ICD, IE, IPSJ-SLDM, IPSJ-EMB, IPSJ-ARC (Joint) [detail] |
2019-11-15 14:15 |
Ehime | Ehime Prefecture Gender Equality Center | Triple-Layered Ring Oscillators and Image Sensors Developed by Direct Bonding of SOI Wafers Masahide Goto (NHK), Yuki Honda (NHK-ES), Toshihisa Watabe, Kei Hagiwara, Masakazu Nanba, Yoshinori Iguchi (NHK), Takuya Saraya, Masaharu Kobayashi (Univ. of Tokyo), Eiji Higurashi (AIST), Hiroshi Toshiyoshi, Toshiro Hiramoto (Univ. of Tokyo) ICD2019-38 IE2019-44 |
We have studied on pixel-parallel three-dimensional (3D) integrated CMOS image sensors. We previously reported double-la... [more] | ICD2019-38 IE2019-44 pp.45-49 |
| VLD, DC, CPSY, RECONF, CPM, ICD, IE, IPSJ-SLDM, IPSJ-EMB, IPSJ-ARC (Joint) [detail] |
2018-12-07 15:15 |
Hiroshima | Satellite Campus Hiroshima | Quarter Video Graphics Array Image Sensor with Linear and Wide-Dynamic-Range Output Developed by Pixel-Wise 3D Integration Masahide Goto, Yuki Honda, Toshihisa Watabe, Kei Hagiwara, Masakazu Nanba, Yoshinori Iguchi (NHK), Takuya Saraya, Masaharu Kobayashi, Eiji Higurashi, Hiroshi Toshiyoshi, Toshiro Hiramoto (Univ. of Tokyo) CPM2018-97 ICD2018-58 IE2018-76 |
We report on pixel-parallel three-dimensional (3D) integrated CMOS image sensors. Photodiodes (PDs), pulse generation ci... [more] | CPM2018-97 ICD2018-58 IE2018-76 pp.43-48 |
| EA, ASJ-H | 2017-12-01 16:20 |
Overseas | University of Auckland (New Zealand) | An efficient spatial sound rendering method for extended reality applications Jorge Trevino, Shuichi Sakamoto, Yoiti Suzuki (Tohoku Univ.) EA2017-82 |
Spatial sound is critical to achieve immersion in virtual reality and realistic integration in mixed reality application... [more] | EA2017-82 pp.127-132 |
| VLD | 2017-03-02 09:25 |
Okinawa | Okinawa Seinen Kaikan | FiCC: Crosstalk Noise Hardened Metal Fringe Capacitor for High Integration Naoyuki Miyagawa, Tomoya Kimura, Hiroyuki Ochi (Ritsumeikan Univ.) VLD2016-109 |
In this paper, we propose Fishbone-in-Cage Capacitor (FiCC) that is a new variant of metal fringe capacitor (MFC), and s... [more] | VLD2016-109 pp.43-47 |
| WBS, RCC, ITS | 2016-12-02 10:05 |
Kagawa | Sunport Hall Takamatsu | 3D Scene Understanding at Urban Intersections for Autonomous Vehicles Prarthana Bhattacharyya, Yanlei Gu, Jiali Bao, Shunsuke Kamijo (UTokyo) WBS2016-69 ITS2016-36 RCC2016-58 |
Urban intersections exhibit very complex driving behavior and are extremely prone to traffic accidents and collisions. I... [more] | WBS2016-69 ITS2016-36 RCC2016-58 pp.125-130 |
| VLD, DC, CPSY, RECONF, CPM, ICD, IE (Joint) [detail] |
2016-11-29 10:55 |
Osaka | Ritsumeikan University, Osaka Ibaraki Campus | Development of power estimation tool for three dimensional FPGA Masato Ikebe, Qian Zhao, Motoki Amagasaki, Masahiro Iida, Morihiro Kuga, Toshinori Sueyoshi (Kumamoto Univ.) RECONF2016-46 |
Three-dimensional (3D) stacking technology is attractive for providing another way to improve the performance of the lar... [more] | RECONF2016-46 pp.35-40 |
| ICD, SDM, ITE-IST [detail] | 2016-08-01 09:15 |
Osaka | Central Electric Club | [Invited Talk]
Accelerating the Sensing World through Imaging Evolution Yusuke Oike, Hayato Wakabayashi, Tetuo Nomoto (Sony Semiconductor Solutions) SDM2016-48 ICD2016-16 |
This presentation introduces the evolution of image sensors and the future prospect of sensing applications utilizing th... [more] | SDM2016-48 ICD2016-16 p.1 |
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