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All Technical Committee Conferences (Searched in: All Years)
| Committee | Date Time | Place | Paper Title / Authors | Abstract | Paper # | |
| SDM | 2024-02-21 14:10 |
Tokyo | Tokyo University-Hongo-Engineering Bldg.4 (Primary: On-site, Secondary: Online) |
[Invited Talk]
Optimization of Pre-Bonding Surface for Cu/SiCN Hybrid Bonding Kohei Nakayama, Kenta Hayama, Yutesu Kamiya, Fmihiro Inoue (YNU)  SDM2023-85 |
Hybrid bonding is considered the key enabler for advanced chiplet integration, which requires finer pitch vertical conne... [more] | SDM2023-85 pp.20-26 |
| AP | 2023-10-19 13:00 |
Iwate | Iwate University (Primary: On-site, Secondary: Online) |
[Poster Presentation]
Effects of mutual coupling on wireless power transmission Yoshihiro Shinagawa, Mitoshi Fujimoto (Fukui Univ.) AP2023-106 |
In recent years, wireless power transmission technology, which uses radio waves to transmit power to terminals, has been... [more] | AP2023-106 pp.69-70 |
| SDM | 2023-02-07 14:40 |
Tokyo | Tokyo Univ. (Primary: On-site, Secondary: Online) |
[Invited Talk]
New Approach for Epoxy Mold Compound Slurry in Advanced Packaging Technology Shogo Arata, Chiaki Noda, Yasuhiro Ichige, Satoyuki Nomura (Resonac), Trianggono Widodo, Nagatoshi Tsunoda, Xavier Brun (Intel) SDM2022-90 |
Chemical mechanical polishing (CMP) process has been a part of semiconductor manufacturing processes from front-end to b... [more] | SDM2022-90 pp.23-26 |
| SDM | 2020-02-07 10:10 |
Tokyo | Tokyo University-Hongo | [Invited Talk]
Stability of Cu Interconnect Surface after post CMP Cleaning Yasuhiro Kawase, Toshiaki Shibata, Tomohiro Kusano (MCC), Ken Harada (imec), Kan Takeshita (MCC) SDM2019-90 |
At present, more than 12 Cu interconnect layers have been formed in advanced semiconductor devices and each layer is pla... [more] | SDM2019-90 pp.9-14 |
| AP | 2019-10-17 12:30 |
Osaka | Osaka Univ. | [Poster Presentation]
FDD Downlink Beamforming Method for Avoiding Adjacent Channel Interference Masaki Igarashi, Kentaro Nishimori (Niigata Univ.) AP2019-80 |
Microwave power transmission systems with high power cause adjacent channel interference. Hence a function is required t... [more] | AP2019-80 pp.5-9 |
| SAT | 2019-10-11 10:50 |
Fukuoka | JR HAKATA CITY {10F RoomA+B} | Suppression of Sidelobe Level over Specific Points in S-band Assuming International Satellite Operation Hiroaki Matsui, Osamu Yoshida, Kota Goto, Tsuyoshi Kuzumaki, Masahiko Sunagawa (SoftBank) SAT2019-58 |
In order to operate a communication satellite, international frequency coordination with neighboring countries is requir... [more] | SAT2019-58 pp.71-76 |
| AP, SANE, SAT (Joint) |
2019-07-18 09:00 |
Miyagi | Tohoku Univ. | High-resolution horizontal permittivity distribution estimation of pavement using array ground penetrating radar Kazutaka Kikuta, Motoyuki Sato (Tohoku Univ.) SANE2019-24 |
In order to detect pavement damage on airport taxiway, we applied a novel method to common midpoint (CMP) dataset obtain... [more] | SANE2019-24 pp.31-36 |
| AP, SANE, SAT (Joint) |
2019-07-19 14:30 |
Miyagi | Tohoku Univ. | 2D Interpolation of GPR Common Midpoint Profile by Using Radial Basis Function Neural Networ k Changyu Zhou, Motoyuki Sato (Tohoku-dai) SANE2019-34 |
A new velocity analysis algorithm for Ground Penetrating Radar (GPR) is investigated. GPR provides the common mid-point ... [more] | SANE2019-34 pp.91-96 |
| MoNA, IN, CNR (Joint) [detail] |
2018-11-15 10:50 |
Saga | Karatsu Civic Exchange Plaza | Client-Based Access Network Selection for Edge Computing Kazuya Okada, Shigeru Kashihara, Yoshihisa Kondo, Nobuo Suzuki, Hiroyuki Yokoyama (ATR) MoNA2018-23 CNR2018-20 |
Research and development of edge computing (EC) technology that provides services at edges of networks are accelerating ... [more] | MoNA2018-23 CNR2018-20 pp.7-12(MoNA), pp.13-18(CNR) |
| OME | 2017-12-01 09:20 |
Saga | Sun Messe Tosu | High efficiency processing and its processing mechanism of large area diamond substrate due to plasma fusion CMP Hidetoshi Takeda (Namiki Precision Jewel Co., Ltd.), Toshiro Doi (Kyushu Univ.), Seong Woo Kim (Namiki Precision Jewel Co., Ltd.), Hideo Aida (Nagaoka Univ. Tech.), Masaharu Shiratani (Kyushu Univ.) OME2017-35 |
SiC, GaN and Diamond are known as next generation semiconductor materials, but on the other hand, these are known as ult... [more] | OME2017-35 pp.1-6 |
| OME | 2017-12-01 09:40 |
Saga | Sun Messe Tosu | Pad-Conditioning/Slurry-Supply Hybrid Effect of High-Pressure-Micro-Jet (HPMJ) Method During CMP Process Keiichi Tsukamoto, Toshiro Doi (Kyushu Univ.), Chengwu Wang (Zhejiang Normal Univ.), Kiyoshi Seshimo (Kyushu Univ.), Keiji Miyachi, Mikihiro Kato (Asahi Sunac Co.), Tadakazu Miyashita (Fujikoshi Machinery Co.), Masanori Ohtsubo, Yoko Matsunaga (Kyushu Univ.) OME2017-36 |
Clogging of the polishing pad is inevitable during CMP process for semiconductor wafer. Conventional reconditioning meth... [more] | OME2017-36 pp.7-12 |
| OME | 2017-12-01 13:10 |
Saga | Sun Messe Tosu | Smart polishing by applying the limelight Dilatancy-Pad
-- Evaluation for Dilatancy-Pad materials and SiC substrates's polishing characteristics -- Kiyoshi Seshimo, Tshiro Doi, Masanori Ohtsubo, Keiichi Tukamoto (Kyushu Univ.), Masataka Takagi (FUJIBO Ehime), Daizo Ichikawa (Fjikoshi Machinery) OME2017-42 |
Dilatancy material has hold the key to construct Smart-polishing technology for hard-to-process material substrates such... [more] | OME2017-42 pp.31-36 |
| SDM | 2017-10-25 14:00 |
Miyagi | Niche, Tohoku Univ. | [Invited Talk]
Zero-step-height planarization: Controlling PMD volume before CMP Tomoyasu Kakegawa, Takuya Futase (SanDisk) SDM2017-50 |
We achieved excellent planarization for a pre-metal dielectric (PMD) layer regardless of its pattern density distributio... [more] | SDM2017-50 pp.1-7 |
| SANE | 2017-10-04 14:30 |
Tokyo | Maison franco - japonaise (Tokyo) | Application for GPR Survey to Faults in Mogod Earthquake in Central Mongolia Tsogtbaatar Amarsaikhan, Motoyuki Sato (Tohoku Univ.) SANE2017-45 |
The 1967 Mogod earthquake (M=7.1) occurred in central Mongolia, which was the largest earthquake after the installation ... [more] | SANE2017-45 pp.11-16 |
| SDM | 2017-02-06 10:05 |
Tokyo | Tokyo Univ. | [Invited Talk]
Impact of Dry Process Damage on Chemical Mechanical Planarization with Cu/low-k Structure Masako Kodera, Hiroyuki Yano, Naoto Miyashita (Toshiba) SDM2016-139 |
We evaluated the impact of process damage caused by dry or sputtering on chemical mechanical planarization (CMP) with Cu... [more] | SDM2016-139 pp.1-4 |
| EMT, IEE-EMT | 2016-11-17 11:50 |
Wakayama | Shirahama Coganoi Resort & Spa | Nondestructive Inspection of Airport Taxiways by Multi-Static Array GPR “YAKUMO” Zou Lilong, Sato Motoyuki (Tohoku Univ.) EMT2016-50 |
In this paper, a multi-statics GPR “YAKUMO” was applied to inspect the health of airport taxiway. The GPR YAKUMO consist... [more] | EMT2016-50 pp.71-76 |
| VLD, DC, IPSJ-SLDM, CPSY, RECONF, ICD, CPM (Joint) [detail] |
2015-12-02 14:10 |
Nagasaki | Nagasaki Kinro Fukushi Kaikan | CSMA/CD and D-TDMA Hybrid Wireless 3D Bus Architecture Go Matsumura (Keio Univ.), Michihiro Koibuchi (NII), Hideharu Amano, Hiroki Matsutani (Keio Univ.) CPSY2015-69 |
(To be available after the conference date) [more] | CPSY2015-69 pp.45-50 |
| SDM | 2013-06-18 15:50 |
Tokyo | Kikai-Shinko-Kaikan Bldg. | [Invited Lecture]
Challenges of high-reliability in SiC-MOS gate structures Junji Senzaki, Atsushi Shimozato, Yasunori Tanaka, Hajime Okumura (AIST) SDM2013-60 |
Influences of wafer-related defect and gate oxide fabrication process on MOS characteristics with gate oxides thermally ... [more] | SDM2013-60 pp.81-86 |
| VLD, IPSJ-SLDM | 2013-05-16 16:25 |
Fukuoka | Kitakyushu International Conference Center | SoC System Design Methodology with Fully-Coherent Cache Kodai Moritaka (NAIST), Hiroaki Yoshida, Mitsuru Tomono (FLA), Yasuhiko Nakashima (NAIST) VLD2013-10 |
As Chip Multi-Processors (CMPs) includes more processor cores in a single chip, the impact of its memory model on the en... [more] | VLD2013-10 pp.73-78 |
| ICM, IPSJ-IOT, IPSJ-CSEC | 2012-05-11 15:25 |
Akita | Akita University | Methods for rapidly testing node reachability on multiple virtual private networks and evaluation Naoki Tateishi, Mitsuho Tahara, Hikaru Seshake (NTT) ICM2012-15 |
Reachability check services with ping are provided as a optional service of VPN provided by telecom carriers. With the e... [more] | ICM2012-15 pp.159-164 |
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