Committee |
Date Time |
Place |
Paper Title / Authors |
Abstract |
Paper # |
EMCJ |
2024-01-19 09:35 |
Kumamoto |
|
Reduction of radiated noise in the power supply layer in PCB
-- Circular grid power layer -- Keisuke Ezoe, Shinichi Sasaki (SU) EMCJ2023-87 |
In recent years, radiated noise generated by the high speed of the mounted LSI has become a problem in printed circuit b... [more] |
EMCJ2023-87 pp.1-6 |
EE |
2024-01-18 15:55 |
Kagoshima |
(Primary: On-site, Secondary: Online) |
[Memorial Lecture]
Switching Power Supply and Power Electronics Masahito Shoyama (Kyushu Univ.) EE2023-45 |
The author has been conducting research on switching power supplies at Kyushu University, an educational and research in... [more] |
EE2023-45 pp.31-36 |
ICD, HWS |
2023-10-31 15:00 |
Mie |
(Primary: On-site, Secondary: Online) |
Side-Channel Leakage Evaluation of 3D CMOS Chip Stacking Kazuki Monta, Rikuu Hasegawa, Takuji Miki, Makoto Nagata (Kobe Univ.) HWS2023-57 ICD2023-36 |
2.5D and 3D packaging are methodologies that include multiple integrated circuit (IC) chips. They deliver enhanced perfo... [more] |
HWS2023-57 ICD2023-36 pp.16-19 |
EMCJ, IEE-EMC, IEE-SPC |
2023-05-12 16:30 |
Okinawa |
(Primary: On-site, Secondary: Online) |
Intensity of electromagnetic noise of a deteriorated power unit Fumihiko Ishiyama (NTT) EMCJ2023-9 |
We are investigating countermeasure technique against electro-magnetic noise with our own method. We evaluated the inten... [more] |
EMCJ2023-9 pp.17-20 |
EMCJ, MICT (Joint) |
2023-03-17 16:05 |
Tokyo |
Kikai-Shinko-Kaikan Bldg (Primary: On-site, Secondary: Online) |
Investigation of reduction method of radiation noise from printed wiring board power supply layer
-- Added resistance structure and reduction effect -- Shuichiro Kohtaki, Sinichi Sasaki (Saga Univ) EMCJ2022-95 |
In recent years, as information equipment has become faster and more densely packed, radiation noise due to highspeed s... [more] |
EMCJ2022-95 pp.19-24 |
HWS, VLD |
2023-03-04 13:55 |
Okinawa |
(Primary: On-site, Secondary: Online) |
* Masaru Mashiba, Kazuki Monta (Kobe Univ.), Takaaki Okidono (SCU), Takuzi Miki, Nagata Makoto (Kobe Univ.) VLD2022-121 HWS2022-92 |
With the development of IoT, security is becoming increasingly important. Confidential information and other information... [more] |
VLD2022-121 HWS2022-92 pp.267-272 |
VLD, DC, RECONF, ICD, IPSJ-SLDM [detail] |
2022-11-29 15:05 |
Kumamoto |
(Primary: On-site, Secondary: Online) |
Evaluation of power delivery networks in secure semiconductor systems Masaru Mashiba, Kazuki Monta (Kobe Univ.), Takaaki Okidono (SCU), Takuzi Miki, Makoto Nagata (Kobe Univ.) VLD2022-33 ICD2022-50 DC2022-49 RECONF2022-56 |
With the development of the IoT, hardware security is becoming increasingly important. Physical attacks on cryptoprocess... [more] |
VLD2022-33 ICD2022-50 DC2022-49 RECONF2022-56 pp.82-86 |
EMCJ, MW, EST, IEE-EMC [detail] |
2022-10-14 09:00 |
Akita |
Akita University (Primary: On-site, Secondary: Online) |
Electromagnetic noise of coupled switching power supplies through power line Fumihiko Ishiyama (NTT) EMCJ2022-51 MW2022-97 EST2022-61 |
We are investigating countermeasure technique against electro-magnetic noise. We applied our method to the analysis of ... [more] |
EMCJ2022-51 MW2022-97 EST2022-61 pp.83-86 |
MICT, WBS |
2022-07-25 09:30 |
Okayama |
Okayama Prefectural University |
[Poster Presentation]
A Study on Performance Improvement of Energy Harvesting in Underwater Simultaneous Light Wave Information and Power Transfer Using Inverted N-CSK Masao Koshimoto, Yusuke Kozawa, Hiromasa Habuchi (Ibaraki Univ) WBS2022-20 MICT2022-20 |
Underwater simultaneous light information and power transfer (USLIPT) has recently attracted attention for efficient exp... [more] |
WBS2022-20 MICT2022-20 pp.18-23 |
CAS, CS |
2022-03-03 14:15 |
Online |
Online |
Noise analysis of nonlinearly coupled circuits Fumihiko Ishiyama (NTT) CAS2021-80 CS2021-82 |
We are investigating countermeasure technique against electro-magnetic noise. We applied our method to the analysis of e... [more] |
CAS2021-80 CS2021-82 pp.37-40 |
NLP, MICT, MBE, NC (Joint) [detail] |
2022-01-21 12:10 |
Online |
Online |
Analysis of nonlinearly mixed noise Fumihiko Ishiyama (NTT) NLP2021-107 MICT2021-82 MBE2021-68 |
We are investigating countermeasure technique against electro-magnetic noise. We applied our method to the analysis of e... [more] |
NLP2021-107 MICT2021-82 MBE2021-68 pp.159-162 |
VLD, DC, RECONF, ICD, IPSJ-SLDM (Joint) [detail] |
2021-12-01 14:20 |
Online |
Online |
A Dual-mode SAR ADC to Detect Power Analysis Attack Takuya Wadatsumi, Takuji Miki, Makoto Nagata (Kobe Univ.) VLD2021-30 ICD2021-40 DC2021-36 RECONF2021-38 |
Distributed IoT devices are exposed to unexpected interferences by physical accesses by malicious attackers. An on-chip ... [more] |
VLD2021-30 ICD2021-40 DC2021-36 RECONF2021-38 pp.78-82 |
VLD, DC, RECONF, ICD, IPSJ-SLDM (Joint) [detail] |
2021-12-01 14:45 |
Online |
Online |
Diagnosis of Switching-Induced IR Drop by On-Chip Voltage Monitors Kazuki (Kobe Univ.), Leonidas Kataselas (Aristotle Univ.), Ferenc Fodor (IMEC), Alkis Hatzopoulos (Aristotle Univ.), Makoto Nagata (Kobe Univ.), Erik Jan Marinissen (IMEC) VLD2021-31 ICD2021-41 DC2021-37 RECONF2021-39 |
On-chip monitor (OCM) circuits enable us to observe dynamic power-supply (PS) waveforms within power domains individuall... [more] |
VLD2021-31 ICD2021-41 DC2021-37 RECONF2021-39 pp.83-86 |
HWS, ICD [detail] |
2021-10-19 11:15 |
Online |
Online |
High-Efficiency simulation method for evaluating power noise and side-channel leakage in crypto modules Kazuki Monta, Takuji Miki, Makoto Nagata (Kobe Univ.) HWS2021-44 ICD2021-18 |
In semiconductor integrated circuits of cryptographic modules, the side-channel leakage from power supply noise is criti... [more] |
HWS2021-44 ICD2021-18 pp.19-22 |
SIP |
2021-08-24 13:00 |
Online |
Online |
Analysis of mixed switching noise Fumihiko Ishiyama (NTT) SIP2021-34 |
We are investigating countermeasure technique against electro-magnetic noise by investigating our own method. We applied... [more] |
SIP2021-34 pp.26-29 |
EE, IEE-HCA |
2021-05-27 11:15 |
Online |
Online |
[Memorial Lecture]
Switched Mode Power Supply and Power Elevtronics Masahito Shoyama (Kyushu Univ.) EE2021-6 |
In this paper, we will introduce some research examples related to "Research and education on switching power supplies f... [more] |
EE2021-6 pp.31-36 |
SDM |
2021-01-28 14:05 |
Online |
Online |
[Invited Talk]
Secure 3D CMOS Chip Stacks with Backside Buried Metal Power Delivery Networks for Distributed Decoupling Capacitance Kazuki Monta (Kobe Univ.) SDM2020-51 |
In semiconductor integrated circuits, power signal integrity(PSI) and electromagnetic compatibility caused by power supp... [more] |
SDM2020-51 pp.8-12 |
MW |
2020-12-10 16:00 |
Kanagawa |
(Primary: On-site, Secondary: Online) |
Experimental evaluation of signal-to-quantization noise power ratio of transversal filter with power amplifier for EPWM transmitter Ryuta Sato, Natuki Utigiri, Taishi Sawayama, Yusuke Koike, Yotaro Umeda, Kyoya Takano (TUS) MW2020-77 |
In recent years, envelope pulse width modulation has been devised for transmitters in wireless communications to meet ma... [more] |
MW2020-77 pp.36-41 |
VLD, DC, RECONF, ICD, IPSJ-SLDM (Joint) [detail] |
2020-11-18 14:25 |
Online |
Online |
On-chip power supply noise monitoring for evaluation of multi-chip board power delivery networks Daichi Nakagawa, Kazuki Yasuda, Masaru Mashiba, Kazuki Monta, Takaaki Okidono, Takuji Miki, Makoto Nagata (Kobe Univ) VLD2020-31 ICD2020-51 DC2020-51 RECONF2020-50 |
In these days, information and communication technology has been evolving more and more, and hardware security has been ... [more] |
VLD2020-31 ICD2020-51 DC2020-51 RECONF2020-50 pp.115-117 |
ICD, SDM, ITE-IST [detail] |
2020-08-06 13:50 |
Online |
Online |
Over-the-top Si Interposer Embedding Backside Buried Metal to Reduce Power Supply Impedance Takuji Miki, Makoto Nagata, Akihiro Tsukioka (Kobe Univ.), Noriyuki Miura (Osaka Univ.), Takaaki Okidono (ECSEC), Yuuki Araga, Naoya Watanabe, Haruo Shimamoto, Katsuya Kikuchi (AIST) SDM2020-5 ICD2020-5 |
A 2.5D structure with a Si interposer stacked on a CMOS chip is developed to reduce power supply impedance. A backside b... [more] |
SDM2020-5 ICD2020-5 pp.19-24 |