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All Technical Committee Conferences (Searched in: All Years)
| Committee | Date Time | Place | Paper Title / Authors | Abstract | Paper # | |
| MW | 2024-06-13 15:10 |
Tokyo | Hachijomachi-shoko-kai (Primary: On-site, Secondary: Online) |
Study on Via-less Dielectric Filled Waveguide-Microstrip Transition for Hybrid Substrates Yu Ushijima, Akimichi Hirota, Ryo Ueda, Masanori Shin, Takashi Maruyama (Mitsubishi)  MW2024-20 |
(To be available after the conference date) [more] | MW2024-20 pp.10-13 |
| MW | 2024-05-17 13:00 |
Osaka | Osaka University Toyonaka Campus (Primary: On-site, Secondary: Online) |
Sub-Terahertz illusion metasurfaces using a stretchable elastic substrate with the dynamic anomalous reflection beam shaping functionality Yuki Tankawa, Yosuke Nakata, Atsushi Sanada (Osaka Univ.) MW2024-16 |
We propose illusion meta-anomalous reflectors that dynamically controls both the angle and width of the reflected beam s... [more] | MW2024-16 pp.46-51 |
| ICM | 2024-03-22 14:00 |
Okinawa | Okinawa Prefectural Museum and Art Museum (Primary: On-site, Secondary: Online) |
Virtual Network Embedding Based on Property of Substrate Network in Multi-service Environments Yamato Negishi, Ryo Yamamoto, Satoshi Ohzahata (UEC) ICM2023-58 |
The need for flexible network control to accommodate diverse service demands in heterogeneous environments is emerging t... [more] | ICM2023-58 pp.65-70 |
| CPM | 2024-02-29 15:35 |
Yamagata | Yamagata University (Primary: On-site, Secondary: Online) |
Preparation of CaFeO3 Thin Film by Pulsed Laser Deposition and Evaluation of Magnetic Properties Daido Yoshihara, Kenshin Kurumai, Reo Tamura, Nobuyuki Iwata (Nihon Univ.) CPM2023-111 |
Using a newly developed UHV pulsed laser deposition system, CaFeOx (CFO) thin films were deposited on SrTiO3 (STO) subst... [more] | CPM2023-111 pp.62-64 |
| OME | 2024-02-22 16:20 |
Tokyo | Kikai-Shinko-Kaikan Bldg. (Primary: On-site, Secondary: Online) |
[Invited Lecture]
Vapor deposition of naphthalenediimide derivatives Hiroaki Usui, Suguru Kuratomi, Takuya Izumi, Yoko Tatewaki (Tokyo Univ. Agricul. & Technol.), Satoshi Usui (Niigata Univ.) OME2023-92 |
Naphthalenediimide derivatives with benzyl and vinyl-benzyl groups were newly synthesized and their thin films were prep... [more] | OME2023-92 pp.30-35 |
| EMCJ | 2024-01-19 09:55 |
Kumamoto | Improved transmission characteristics at bends in high-speed signal lines Akinori Nomoto, Sinichi SasakiSasaki (SU) EMCJ2023-88 |
In recent years, with the downsizing and higher functionality of information equipment, the deterioration of transmissio... [more] | EMCJ2023-88 pp.7-10 |
|
| EA, US (Joint) |
2023-12-22 15:20 |
Fukuoka | [Poster Presentation]
SMR-type piezoelectric transformer using shear mode c-axis zigzag ScAlN multilayer Kazutaka Siraiwa (Waseda Univ.), Takahiko Yanagitani (Waseda univ.) US2023-64 |
RF signal can be converted to DC signal using an antenna and diode (rectenna). When distance of wireless transfer is lon... [more] | US2023-64 pp.47-52 |
|
| ED | 2023-12-08 10:25 |
Aichi | WINC AICHI | Photo-assisted Electron Emission Properties of Graphene-Oxide-Semiconductor Electron Source Hidetaka Shimawaki (Hachinohe Inst. Technol.), Masayoshi Nagao, Katsuhisa Murakami (AIST) ED2023-49 |
Planar-type electron sources based on graphene/oxide/semiconductor (GOS) structures have demonstrated excellent performa... [more] | ED2023-49 pp.43-44 |
| LQE, ED, CPM | 2023-11-30 13:05 |
Shizuoka | AlGaInN/GaN highhigh-electron mobility transistors with a thin unintentionally doped GaN channel and an AlN back barrier formed using a single single-crystal AlN substrate Tomoyuki Kawaide, Yoshinobu Kometani, Sakura Tanaka, Takashi Egawa, Makoto Miyoshi (Nagoya Inst. Tech) ED2023-14 CPM2023-56 LQE2023-54 |
A high-electron-mobility transistor (HEMT) structure with a strain-engineered quaternary AlGaInN barrier layer, a thin u... [more] | ED2023-14 CPM2023-56 LQE2023-54 pp.1-5 |
|
| LQE, ED, CPM | 2023-12-01 09:55 |
Shizuoka | Simultaneous microscopic PA/PL line-scan measurements in InGaN-quantum wells on a stripe-core GaN Substrate Syoki Jinno, Atsushi A. Yamaguchi, Keito Mori-Tamamura (Kanazawa Inst. of Tech.), Susumu Kusanagi, Yuya Kanitani, Shigetaka Tomiya, Yoshihiro Kudo (Sony Semiconductor Solutions Corp.) ED2023-25 CPM2023-67 LQE2023-65 |
Accurate measurement of internal quantum efficiency (IQE) is necessary for a comprehensive understanding of the electron... [more] | ED2023-25 CPM2023-67 LQE2023-65 pp.52-55 |
|
| US | 2023-11-27 13:45 |
Shizuoka | Shizuoka University | Improvement of in-plane orientation and piezoelectricity of c-axis parallel oriented ZnO films and their application to thickness shear-mode resonators
-- Investigation on limiting of particle irradiation to substrate during sputtering deposition -- Naoki Tomiyama, Shinji Takayanagi (Doshisha Univ.), Yanagitani Takahiko (Waseda Univ.) US2023-49 |
ZnO films with the crystalline c-axis parallel to the substrate can excite shear waves and are suitable for thickness-sh... [more] | US2023-49 pp.34-39 |
| US | 2023-11-27 16:10 |
Shizuoka | Shizuoka University | 30-layer polarization inversion HBAR for acoustic separation of piezoelectric layer and substrate Kazutaka Shiraiwa, Takahiko Yanagitani (Waseda univ) US2023-54 |
There are two types of BAW resonators, FBAR (film bulk acoustic resonator: free standing structure) and SMR (Solidly mou... [more] | US2023-54 pp.61-66 |
| VLD, DC, RECONF, ICD, IPSJ-SLDM [detail] | 2023-11-17 09:35 |
Kumamoto | Civic Auditorium Sears Home Yume Hall (Primary: On-site, Secondary: Online) |
Backside Side-Channel Attack by Silicon Substrate Voltage and Simulation Rikuu Hasegawa, Kazuki Monta, Takuya Watatsumi, Takuji Miki, Makoto Nagata (Kobe Univ) VLD2023-63 ICD2023-71 DC2023-70 RECONF2023-66 |
Integrated circuit (IC) chips equipped with cryptographic circuits are vulnerable to side-channel attacks, which use exp... [more] | VLD2023-63 ICD2023-71 DC2023-70 RECONF2023-66 pp.173-177 |
| VLD, DC, RECONF, ICD, IPSJ-SLDM [detail] | 2023-11-17 10:25 |
Kumamoto | Civic Auditorium Sears Home Yume Hall (Primary: On-site, Secondary: Online) |
Analysis for S-parameter differences caused by differences in ground definitions for electromagnetic simulations in high-frequency differential GSSG PADs Ryotaro Sugimoto, Satoshi Tanaka, Takeshi Yoshida, Minoru Fujishima (Hiroshima Univ.) VLD2023-65 ICD2023-73 DC2023-72 RECONF2023-68 |
In order to realize transceiver circuits operating in the 300-GHz band, which can achieve 100-Gigabit-per-second high-sp... [more] | VLD2023-65 ICD2023-73 DC2023-72 RECONF2023-68 pp.182-186 |
| SDM | 2023-11-10 15:30 |
Tokyo | (Primary: On-site, Secondary: Online) |
[Invited Talk]
DFT study on electronic structure and carrier-transport property of SiC-MOS interface. Tomoya Ono (Kobe Univ.) SDM2023-73 |
Density functional theory calculations for investigation of electronic structure and charrier scattering property of the... [more] | SDM2023-73 pp.47-50 |
| EMT, IEE-EMT | 2023-11-10 11:10 |
Yamaguchi | Kaikyo Messe Shimonoseki | Simultaneous Learning Algorithm of Optical Linear Discriminant Filter and Neural Network
-- Application to the discrimination of fine three-dimensional defects on dielectric surfaces -- Shingo Shimada, Jun-ichiro Sugisaka, Koichi Hirayama, Takashi Yasui (Kitami Inst. Tech.) EMT2023-79 |
Various optical measurement methods using optical measurement technique and machine learning have been proposed to discr... [more] | EMT2023-79 pp.91-95 |
| ICD, HWS | 2023-10-31 15:00 |
Mie | (Primary: On-site, Secondary: Online) |
Side-Channel Leakage Evaluation of 3D CMOS Chip Stacking Kazuki Monta, Rikuu Hasegawa, Takuji Miki, Makoto Nagata (Kobe Univ.) HWS2023-57 ICD2023-36 |
2.5D and 3D packaging are methodologies that include multiple integrated circuit (IC) chips. They deliver enhanced perfo... [more] | HWS2023-57 ICD2023-36 pp.16-19 |
| SDM | 2023-10-13 13:00 |
Miyagi | Niche, Tohoku Univ. | [Invited Talk]
Defect Reduction in UV Nanoimprint Lithography Toshiki ITO (Canon) SDM2023-54 |
Field-by-field type UV nanoimprint lithography equipped with on-demand inkjet dispense system has been developed, which ... [more] | SDM2023-54 pp.1-6 |
| SDM | 2023-10-13 17:00 |
Miyagi | Niche, Tohoku Univ. | A study on the integration process of ReRAM and OFET utilizing Nitrogen doped LaB6/LaBxNy stacked structure Jiaang Zhao, Shun-ichiro Ohmi (Tokyo Tech) SDM2023-61 |
LaBxNy insulator films are realized by utilizing Ar/N2 plasma reactive sputtering with nitrogen doped LaB6 as a target. ... [more] | SDM2023-61 pp.46-49 |
| MW, AP (Joint) |
2023-09-28 16:15 |
Kochi | Kochi Castle Museum of History (Primary: On-site, Secondary: Online) |
Comparison of Transmission Characteristics of Wire Bonding and Flip Chip Bonding by Electromagnetic Simulation Takuichi Hirano (Tokyo City Univ.) MW2023-85 |
Wire bonding connections and flip-chip connections are mainly used to connect RF chips and substrates. In this paper, th... [more] | MW2023-85 pp.22-27 |
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