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 Conference Papers (Available on Advance Programs)  (Sort by: Date Descending)
 Results 1 - 20 of 24  /  [Next]  
Committee Date Time Place Paper Title / Authors Abstract Paper #
LQE, ED, CPM 2023-11-30
14:20
Shizuoka   Steam Oxidation Technique for Defect Reduction on ALD-Al2O3 Insulated-gate structures
Shiro Ozaki, Yusuke Kumazaki, Naoya Okamoto, Yasuhiro Nakasya, Toshihiro Tagi, Naoki Hara (Fujitsu) ED2023-17 CPM2023-59 LQE2023-57
In this study, we investigated the effect of oxidant sources on carbon-related impurities in atomic layer deposited (ALD... [more] ED2023-17 CPM2023-59 LQE2023-57
pp.15-20
SDM 2021-10-21
13:50
Online Online A study on Hf-based MONOS nonvolatile memory with HfO2 and HfON tunneling layers for multi-bit/cell operation
Pyo Jooyoung, Ihara Akio, Ohmi Shun-ichiro (Tokyo Tech.) SDM2021-48
We investigated the in-situ formed Hf-based MONOS non-volatile memory (NVM) device with HfO2 and HfON tunneling layer (T... [more] SDM2021-48
pp.16-19
SCE 2021-01-19
13:30
Online Online Thermal Conductance of Tri-layer Membranes for Multi-Pixel Gamma-Ray Transition Edge Sensors
Takahiro Kikuchi, Satoshi Kohjiro, Ryota Hayakawa, Go Fujii, Fuminori Hirayama, Masahiro Ukibe (AIST), Ryan Smith, Masashi Ohno (U-Tokyo) SCE2020-18
We have been developing the Gamma-ray Transition Edge Sensors (TESs) which is able to achieve high energy resolution. Mu... [more] SCE2020-18
pp.7-12
LQE, CPM, ED 2020-11-26
15:30
Online Online Enhanced Breakdown Voltage in AlGaN/GaN HEMTs by Oxygen Plasma Treatment
Shunsuke Kamiya, Takashi Nishitani, Yu Matsuda, Nozomu Takano, Joel T. Asubar, Hirokuni Tokuda (Univ. of Fukui), Masaaki Kuzuhara (Kwansei Gakuin Univ.) ED2020-12 CPM2020-33 LQE2020-63
With its high critical electric field as consequence of its wide bandgap, gallium nitride (GaN) is considered a leading ... [more] ED2020-12 CPM2020-33 LQE2020-63
pp.45-48
CPM, LQE, ED 2019-11-21
13:55
Shizuoka Shizuoka Univ. (Hamamatsu) Estimation of device characteristics of AlGaN/GaN MIS-HEMTs with SiO2/Al2O3 double insulators fabricated by ALD
Shunichi Yokoi, Keita Furuoka, Toshiharu Kubo, Takashi Egawa (Nagoya Inst. of Tech.) ED2019-41 CPM2019-60 LQE2019-84
SiO2 has a relatively large band gap of approximately 9 eV. Therefore, by fabricating SiO2/Al2O3 double insulators, GaN-... [more] ED2019-41 CPM2019-60 LQE2019-84
pp.37-40
EMD 2019-03-01
10:35
Tokyo   A study in influences of external magnetic field on break arc characteristics of AgSnO2 contacts in a DC inductive load circuit up to 20V-17A up to 20V-17A
Seika Tokumitsu, Makoto Hasegawa (Chitose Inst. of Science & Technology) EMD2018-59
For the purpose of investigating influences of application of an external magnetic field on shortenings of break arc dur... [more] EMD2018-59
pp.1-6
PN, EMT, OPE, EST, MWP, LQE, IEE-EMT [detail] 2019-01-17
16:20
Osaka Osaka University Nakanoshima Center Surface Improvement Investigation of Sol-Gel SiO2 Cladding for Waveguide Device Passivation
Satoshi Ogawa, Ahmad Syahrin Idris, Yu Han, Haisong Jiang, Kiichi Hamamoto (Kyushu Univ.) PN2018-53 EMT2018-87 OPE2018-162 LQE2018-172 EST2018-100 MWP2018-71
For exploiting sol-gel SiO2 for waveguide device passivation, plasma-ashing, in addition to 700 ℃ annealing, is proposed... [more] PN2018-53 EMT2018-87 OPE2018-162 LQE2018-172 EST2018-100 MWP2018-71
pp.127-130
SDM 2018-06-25
11:40
Aichi Nagoya Univ. VBL3F Control of SiO2/GaN Interface for High-performance GaN MOSFET
Tauji Hosoi, Takahiro Yamada, Mikito Nozaki (Osaka Univ.), Tokio Takahashi, Hisashi Yamada, Mitsuaki Shimizu (AIST), Akitaka Yoshigoe (JAEA), Takayoshi Shimura, Heiji Watanabe (Osaka Univ.) SDM2018-18
A high-quality gate insulator together with low interface states is indispensable for GaN-based power MOSFETs. We have r... [more] SDM2018-18
pp.11-14
SDM 2018-06-25
15:15
Aichi Nagoya Univ. VBL3F Chemical Bonding Features and Thermal Stability at SiO2/GaN interfaces Formed by Remote O2 Plasma Enhanced CVD
Ryohei Matsuda, Akio Ohta (Nagoya Univ.), Noriyuki Taoka (AIST), Mitsuhisa Ikeda, Katsunori Makihara (Nagoya Univ.), Mitsuaki Shimizu (AIST), Seiichi Miyazaki (Nagoya Univ.) SDM2018-22
A ~6.2 nm-thick SiO2 was deposited on n-type GaN(0001) by the remote O2 plasma enhanced CVD, and chemical bonding featur... [more] SDM2018-22
pp.29-32
LQE, CPM, ED 2017-12-01
12:30
Aichi Nagoya Inst. tech. Characterization of Chemical Structure and Electrical Properties of Remote O2 Plasma Enhanced CVD SiO2/GaN(0001) structures
NguyenXuan Truyen (Nagoya Univ.), Noriyuki Taoka (AIST GaN OIL), Akio Ohta (Nagoya Univ.), Hisashi Yamada, Tokio Takahashi (AIST GaN OIL), Mitsuhisa Ikeda, Katsunori Makihara (Nagoya Univ.), Mitsuaki Shimizu (AIST GaN OIL), Seiichi Miyazaki (Nagoya Univ.) ED2017-61 CPM2017-104 LQE2017-74
Impacts of post-deposition annealing (PDA) on interface properties in a SiO2/GaN structure formed by a remote oxygen pla... [more] ED2017-61 CPM2017-104 LQE2017-74
pp.61-64
ED 2017-04-20
15:25
Miyagi   Fabrication of SnO2 film using room temperature atomic layer deposition
Syunsuke Saito, Kentaro Tokoro, Kensaku Kanomata, Masanori Miura, Bashir Ahmmad, Shigeru Kubota, Fumihiko Hirose (Yamagata Univ.) ED2017-5
Since most of the gas sensors using tin oxide (SnO2) are sintered type, there is a problem that variations in characteri... [more] ED2017-5
pp.17-20
MW, ED 2017-01-27
09:55
Tokyo Kikai-Shinko-Kaikan Bldg. Dependence of Electron Mobility on Deposition Temperature and H2 Annealing in MOSFETs with HfO2/Al2O3/InGaAs Gate Stacks
Kazuto Ohsawa, Shinji Noguchi, Seiko Netsu, Nobukazu Kise, Yasuyuki Miyamoto (Tokyo Tech) ED2016-103 MW2016-179
III–V compound semiconductors are promising materials for future n-type MOSFET channels because of their high elec... [more] ED2016-103 MW2016-179
pp.35-40
SDM 2016-06-29
14:45
Tokyo Campus Innovation Center Tokyo Low Temperature Formation of Thin SiO2 Film by Using Remote Oxygen Plasma Enhanced CVD
NguyenXuan Truyen, Nobuyuki Fujimura, Daichi Takeuchi, Akio Ohta, Katsunori Makihara, Mitsuhisa Ikeda, Seiichi Miyazaki (Nagoya Univ.) SDM2016-41
SiO2 thin films have been deposited on H-terminated Si surface by remote O2 plasma enhanced CVD (O2-RPCVD) using SiH4 an... [more] SDM2016-41
pp.49-52
ED 2016-04-21
16:25
Yamagata   Room-temperature atomic layer deposition of TiO2 on nanoparticles
Ko Kikuchi, Kensaku Kanomata, Masanori Miura, Bashir Ahmmad Arima, Shigeru Kubota, Fumihiko Hirose (Yamagata Univ) ED2016-5
Metal oxide modification on nanoparticles has attracted attention to achieve new surface functions on them. Room-tempera... [more] ED2016-5
pp.17-20
ED 2015-04-17
09:55
Miyagi Laboratory for Nanoelectronics and Spintronics Reaction mechanism of room temperature HfO2 atomic layer deposition using remote plasma excited water and oxygen
Kensaku Kanomata, Hisashi Ohba, P. Pungboon Pansila, Bashir Ahmmad Arima, Shigeru Kubota, Kazuhiro Hirahara, Fumihiko Hirose (Yamagata Univ.) ED2015-11
Room-temperature atomic layer deposition (ALD) of hafnium dioxide is developed using tetrakis(ethylmethylamino)hafnium (... [more] ED2015-11
pp.53-58
SDM 2014-06-19
09:30
Aichi VBL, Nagoya Univ. Process Design of High-k/Ge Gate Stack for Improving Thermal Stability and Interface Properties in Sub-1-nm Regime
Ryohei Asahara, Takuji Hosoi, Takayoshi Shimura, Heiji Watanabe (Osaka Univ.) SDM2014-43
Suppression of GeOx formation and Ge diffusion into high-k layer is important to develop sub-1-nm EOT metal/high-k gate ... [more] SDM2014-43
pp.1-5
SDM, ED
(Workshop)
2012-06-28
10:00
Okinawa Okinawa Seinen-kaikan Effects of Light and Air Exposures on Electrical Properties of GeO2/Ge and Al2O3/Ge Gate Stack Structures
Kusumandari, Wakana Takeuchi, Kimihiko Kato, Shigehisa Shibayama, Mitsuo Sakashita, Noriyuki Taoka, Osamu Nakatsuka, Shigeaki Zaima (Nagoya Univ.)
Low temperature processes such as plasma process are required for realizing Ge metal-oxide-semiconductor field effect tr... [more]
SDM 2009-12-04
15:50
Nara NAIST Formation of High Quality SiO2 and SiO2/Si Interface using Thermal Plasma Jet Induced Millisecond Annealing and Post-Metallization Annealing
Yasuo Hiroshige, Seiichiro Higashi, Yusuke Miyazaki, Kazuya Matsumoto, Seiichi Miyazaki (Hiroshima Univ.) SDM2009-166
Thermal plasma jet (TPJ) induced millisecond annealing has been performed to SiO2 films deposited at 300C by remote plas... [more] SDM2009-166
pp.79-82
SDM 2009-10-30
13:00
Miyagi Tohoku University Recovery from Reactive Ion Etching Damage in SiO2 Films
Nobuhito Kawada, Satoshi Nagashima, Toru Ichikawa, Hiroshi Akahori (Toshiba Corp.) SDM2009-129
As the MOS device shrinkage progress, the influence of RIE(Reactive Ion Etching) damage becomes remarkable. Especially, ... [more] SDM2009-129
pp.51-56
SDM 2009-06-19
13:40
Tokyo An401・402 Inst. Indus. Sci., The Univ. of Tokyo Improvement of electrical characteristics of HfO2/Ge MIS structure treated by fluorine gas and nitrogen radical
Hideto Imajo, Hyun Lee, Dong-Hun Lee, Yuichi Yoshioka, Takeshi Kanashima, Masanori Okuyama (Osaka Univ.) SDM2009-34
The electrical properties and interface states have been improved by fluorine treatment on Ge, but there was a problem w... [more] SDM2009-34
pp.45-50
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